Method for cutting ceramic by laser
A technology of laser cutting and ceramics, applied in the field of laser applications, can solve the problems of poor thermal stability, reduce the excellent performance of the substrate, and the laser energy cannot be effectively gathered, and achieve the effect of improving cutting efficiency and good cutting effect.
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[0021] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following is a detailed description in conjunction with the embodiments and accompanying drawings.
[0022] Laser processing technology is a technology that uses the characteristics of the interaction between the laser beam and the substance to cut, weld, surface treatment, perforate, micro-process materials (including metals and non-metals), and use as a light source to identify objects. Traditional applications The largest area is laser processing technology. Laser processing systems include lasers, light guide systems, processing machine tools, control systems and inspection systems.
[0023] See figure 1 , A method of laser cutting ceramics, including:
[0024] S1. Select the part to be cut on the ceramic body;
[0025] The thickness of the ceramic body is: 0.1mm to 2.0mm.
[0026] S2. Coat the cut part with a non-volatile, non-flammable, ...
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