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Method for cutting ceramic by laser

A technology of laser cutting and ceramics, applied in the field of laser applications, can solve the problems of poor thermal stability, reduce the excellent performance of the substrate, and the laser energy cannot be effectively gathered, and achieve the effect of improving cutting efficiency and good cutting effect.

Inactive Publication Date: 2012-06-27
SHENZHEN MUSEN TECH
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Problems solved by technology

However, ceramics are hard and brittle materials with poor thermal stability. When cutting, recast layers and cracks are easy to form, which reduces the original excellent performance of the substrate. Moreover, ceramics are reflective, so that the energy of the laser cannot be effectively gathered.

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  • Method for cutting ceramic by laser
  • Method for cutting ceramic by laser

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Embodiment Construction

[0021] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0022] Laser processing technology is a technology that uses the characteristics of the interaction between the laser beam and the material to cut, weld, surface treat, drill, micro-process, and use it as a light source to identify objects, etc., for materials (including metals and non-metals). The largest field is laser processing technology. Laser processing systems include lasers, light guide systems, processing machine tools, control systems and detection systems.

[0023] see figure 1 , a method of laser cutting ceramics, comprising:

[0024] S1. Select the part to be cut on the ceramic body;

[0025] The thickness of the ceramic body is: 0.1mm-2.0mm.

[0026] S2. Coating the cut part with a non-volatile, non-flammable, non-transpa...

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Abstract

The invention discloses a method for cutting ceramic by laser, which includes: S1, selecting portions of ceramic required to be cut; S2, coating a non-volatile non-transparent adsorption layer onto the portions to be cut; and S3, cutting along the portions to be cut by moving a laser beam. Since the adsorption layer used in the method can adsorb laser energy, cutting efficiency can be improved.

Description

technical field [0001] The invention relates to the field of laser applications, in particular to a laser cutting method for ceramics. Background technique [0002] The existing ceramic crack-free cutting method basically adopts (CO2 or Nd:YAG) laser, under the premise of constant single pulse energy, the pulse width is compressed to ns level, and the pulse frequency is increased to 10-20KHz level. Its obvious disadvantage is that it requires high equipment capacity, often requires multiple repeated cutting or pre-processing, and the practical cutting efficiency is low. With the increase of cutting speed, the slag changes from a flat shape to a directional corrugated shape; when cutting from low speed to high speed The reduction in the degree of superposition of individual pulses transforms the slag from a planar state to a discontinuous state. The cutting method is also converted from gasification and melting to fracture caused by additional partial thermal shock, and frac...

Claims

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Application Information

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IPC IPC(8): B23K26/40B23K26/18B23K26/14B23K26/142B23K26/38B23K26/402
Inventor 彭信翰
Owner SHENZHEN MUSEN TECH
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