Polyimide precursor resin solution and film, laminated board and PCB

Abstract

The present invention provides a polyimide precursor resin solution comprising a polyimide precursor resin and a film using the same, a metal-coated laminated board and a flexible PCB. Especially, the present invention provides the polyimide precursor resin solution which is capable of obtaining a polyimide resin film having a good physical property and has the advantages of high concentration, low viscosity, good processability, and good storage stability. The polyimide precursor resin solution comprises the polyimide precursor resin showed in the following formula (1), wherein R1 represents a tetravalent organic group, R2 represents a divalent organic group, R3 and R4 are respectively the same or the different, and represent hydrogen atom or univalent organic group, R5 represents a trivalent organic group, and n represents an integral number more than 2.

Description

technical field [0001] The present invention relates to a polyimide precursor resin solution containing a polyimide precursor resin and a coating film, a metal-clad laminate and a flexible printed circuit board using the same. Background technique [0002] Polyimides are useful for applications in the field of electronics, as insulating films or protective coatings on semiconductor devices. In particular, wholly aromatic polyimides greatly contribute to densification and multifunctionalization of flexible circuit boards and integrated circuits due to their excellent heat resistance, mechanical properties, and electrical properties. In this way, when forming a fine circuit interlayer insulating film and a protective film, a solution of a polyimide precursor has been conventionally used. As such a polyimide precursor solution, a polyamic acid solution obtained by reacting a diamine compound with a tetracarboxylic dianhydride, and a polyamic acid solution containing polyamic a...

AI Technical Summary

Problems solved by technology

However, when coating the polymer solution with a high degree of polymerization, because of its high degree of polymerization, there is a problem that the solute concentration must be reduced in order to make the viscosity of the solution sufficient for the coating operation.

In addition, in order to improve productivity, if the solute concentration is increased, the viscosity of the solution increases, and there is a problem that the coating operation cannot be performed. In addition, the solute concentration is high and the polymer has a low molecular weight in order to make it a viscosity that can satisfy the coating operation. However, there is a problem that coating films and films with excellent mechanical and thermal properties cannot be obtained.

Moreover, the polymer solution is not easy to store for a long time, and it is extremely difficult to store it for a long time while maintaining its degree of polymerization.

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