Polyimide precursor resin solution and film, laminated board and PCB

A technology of polyimide precursor and resin solution, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., can solve the problems of excellent thermal characteristics, difficult long-term storage, high degree of polymerization, etc., and achieve excellent processability and storage Excellent stability and excellent balance of physical properties

Active Publication Date: 2014-12-10
ARISAWA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when coating the polymer solution with a high degree of polymerization, because of its high degree of polymerization, there is a problem that the solute concentration must be reduced in order to make the viscosity of the solution sufficient for the coating operation.
In addition, in order to improve productivity, if the solute concentration is increased, the viscosity of the solution increases, and there is a problem that the coating operation cannot be performed. In addition, the solute concentration is high and the polymer has a low molecular weight in order to make it a viscosity that can satisfy the coating operation. However, there is a problem that coating films and films with excellent mechanical and thermal properties cannot be obtained.
Moreover, the polymer solution is not easy to store for a long time, and it is extremely difficult to store it for a long time while maintaining its degree of polymerization.

Method used

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  • Polyimide precursor resin solution and film, laminated board and PCB
  • Polyimide precursor resin solution and film, laminated board and PCB
  • Polyimide precursor resin solution and film, laminated board and PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0181] (1) Polymerization of the amine-terminated polyimide precursor resin represented by the following formula (2)'

[0182] [chemical formula 19]

[0183]

[0184] In the formula, R 1 It represents any one or more of the structures represented by the following formula (5).

[0185] [chemical formula 20]

[0186]

[0187] R 2 It represents any one or more of the structures represented by the following formula (6).

[0188] [chemical formula 21]

[0189]

[0190] 240 g of NMP was added to a 500 L flask as a polymerization solvent. Then, 11.982 g (0.1108 mol) of p-PDA and 7.389 g (0.0369 mol) of 4,4'-DAPE were added as a diamine component, and it stirred and melt|dissolved at 30 degreeC.

[0191] 37.543 g (0.1276 mol) of BPDA and 3.097 g (0.0142 mol) of PMDA were added gradually to the obtained solution as a tetracarboxylic dianhydride component. Then, by stirring at room temperature for 10 hours, a solution (A) containing the amine-terminated polyimide precurs...

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Abstract

PROBLEM TO BE SOLVED: To provide a polyimide precursor resin solution, which can obtain a polyimide resin coating film having satisfactory physical properties and has a high concentration and a low viscosity, and in which workability and storage stability are consistent.SOLUTION: The polyimide precursor resin solution contains a polyimide precursor resin represented by a formula (1) (in the formula (1), R<SB POS="POST">1< / SB>denotes a tetravalent organic group, R<SB POS="POST">2< / SB>denotes a bivalent organic group, R<SB POS="POST">3< / SB>and R<SB POS="POST">4< / SB>are the same or different from each other, respectively, and denote a hydrogen atom or a monovalent organic group, R<SB POS="POST">5< / SB>denotes a trivalent organic group, and n denotes an integer of ≥2).

Description

technical field [0001] The present invention relates to a polyimide precursor resin solution containing a polyimide precursor resin and a coating film, a metal-clad laminate and a flexible printed circuit board using the same. Background technique [0002] Polyimides are useful for applications in the field of electronics, as insulating films or protective coatings on semiconductor devices. In particular, wholly aromatic polyimides greatly contribute to densification and multifunctionalization of flexible circuit boards and integrated circuits due to their excellent heat resistance, mechanical properties, and electrical properties. In this way, when forming a fine circuit interlayer insulating film and a protective film, a solution of a polyimide precursor has been conventionally used. As such a polyimide precursor solution, a polyamic acid solution obtained by reacting a diamine compound with a tetracarboxylic dianhydride, and a polyamic acid solution containing polyamic a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C09D179/08B32B15/08H05K1/03
CPCB32B15/088C08G73/1067C08L79/08C09D179/08H05K1/0366
Inventor 松山浩幸安达俊哉
Owner ARISAWA MFG CO LTD
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