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Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof

A multi-functional, substrate-based technology, applied in the direction of grinding devices, grinding drive devices, grinding/polishing equipment, etc., can solve the problems of not being applicable to different usage requirements of various substrates, reduce production costs and improve product quality , the effect of improving efficiency

Active Publication Date: 2012-07-11
宁波知行半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These existing grinding and polishing machines are often not suitable for the different usage requirements of various substrates

Method used

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  • Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof
  • Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof
  • Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1, using the axial incision grinding and polishing method to process the disc-shaped substrate, see Figure 4 . The processed substrate W is placed on the suction cup 12, and the worktable 3 is driven by the feed mechanism 8 to move forward in the direction of the arrow b in the horizontal direction to the bottom of the grinding spindle unit 18, and the center of the wafer-shaped substrate W is Located at the outer edge of the grinding wheel 15, the workbench 3 is kept fixed in the horizontal direction. Driven by the workpiece spindle 11, the substrate W is rotated along the chuck rotation direction i. The grinding wheel 15 of the grinding spindle unit 18 rotates along the grinding wheel rotation direction 1e; at the same time, the grinding spindle unit 18 feeds along the d direction of the grinding feed direction when the motor 26 rotates forward, and as a result, the The substrate W is subjected to conventional fixed-pass grinding. Or the grinding spindl...

Embodiment 2

[0019] Embodiment two, adopting radial cut-in type grinding and polishing method to process square chip substrate, see Figure 4 . The grinding wheel 15 of the grinding spindle unit 18 rotates in the direction e. Simultaneously, the grinding spindle unit 18 feeds downwards along the d of the grinding feed direction when the motor 26 rotates forward, keeps the grinding spindle unit 18 fixed in position on the grinding feed direction, and the workbench 3 is positioned on the feed mechanism 8 Driven by the driving force, move toward b in the horizontal direction until the edge of the substrate W touches the outer edge of the grinding wheel 15 and start grinding, and continue to move in the direction b in the horizontal direction until the edge of the substrate W breaks away from the outer edge of the grinding wheel 15 to end the grinding. Driven by the feed mechanism 8, the workbench 3 moves horizontally toward the direction a and returns to the initial grinding position. The th...

Embodiment 3

[0020] Embodiment three, adopt the edge grinding and polishing method to process, see Figure 5. When a small-diameter grinding wheel or polishing wheel 40 is used, edge-reserving grinding or edge-reserving polishing can be realized, and the diameter of the small-diameter grinding wheel or polishing wheel 40 is slightly smaller than the radius of the substrate W. The substrate W to be processed is placed on the suction cup 12, and the worktable 3 is moved forward in the horizontal direction toward b to the bottom of the grinding spindle unit 18 under the drive of the feed mechanism 8, so that the outer edge of the grinding wheel 15 passes through the circle. At the center of the sheet-like substrate W, the position of the holding table 3 in the horizontal direction is fixed. Driven by the workpiece main motor shaft 11, the substrate W is rotated along the i direction of the chuck rotation direction. The grinding wheel 15 of the grinding spindle unit 18 is so as to rotate alo...

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Abstract

The invention discloses a multifunctional substrate polishing and burnishing device and a polishing and burnishing method thereof, which belong to the technical field of ultraprecision machining of a planar substrate and relate to polishing and burnishing leveled machining and thinning machining of hard and crisp materials, such as silicon wafers, sapphire substrates and glass base plates. The multifunctional substrate polishing and burnishing device and the polishing and burnishing method thereof can be used for polishing and burnishing planar thin plates, such as ceramics, metal and composite materials. The substrate polishing and burnishing method comprises three modes of axial cut-in polishing and burnishing, radial cut-in polishing and burnishing and margin-leaving polishing and burnishing. The polishing and burnishing device adopts a double-spindle structure composed of a spindle polishing unit and a spindle burnishing unit; the substrate is polished and burnished on one device; the spindle polishing unit and the spindle burnishing unit are dragged by one traction rope and are in mutual counter weight; the polishing and burnishing device integrates a polishing machine and a burnishing machine; two working procedures of burnishing and polishing can be finished only by one-time clamping of the substrate, the polishing and burnishing machining precision and the polishing and burnishing machining automation of the substrate are improved, a fragment rate is lowered, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing of planar substrates, and specifically relates to a grinding, polishing, flattening and thinning processing of planar substrates of hard and brittle materials such as silicon wafers, sapphire substrates and glass substrates, and can also be used for ceramics. Grinding and polishing of flat thin plates such as metals and composite materials. Background technique [0002] Ultra-precision surface processing and ultra-precision thinning processing of flat sheet-like substrates such as silicon wafers, sapphire substrates, glass panels, and ceramic sheets, usually go through grinding, lapping, and polishing processes, respectively, by grinding, grinding machines, and The polishing machine is completed independently. Grinding and grinding machine tools are used to smooth the surface of the substrate to make the substrate reach a predetermined thickness and obtain a high-quality surface...

Claims

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Application Information

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IPC IPC(8): B24B37/013B24B37/07B24B37/27B24B29/00B24B47/20
Inventor 康仁科朱祥龙董志刚冯光郭东明
Owner 宁波知行半导体有限公司
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