Device and method for continuous smelting of high-purity high-conductivity copper

Abstract

The invention discloses a device and a method for continuous smelting of high-purity high-conductivity copper, which comprises a smelting furnace, a heat preserving furnace and a degassing device. A compartment is mounted between the smelting furnace and the heat preserving furnace, the degassing device is mounted on the upper portion of the compartment and comprises a frame, and a spindle is vertically sleeved on the frame and connected with a spindle motor through a rotary connector. A metal rotary rod is sleeved to the lower end of the spindle, a graphite rotary rod is sleeved on the metal rotary rod, and the spindle is movably connected with a heat insulating device which is connected with a lifting motor through a lifting screw. The production process is simple while production is stable by using the continuous smelting device, and the continuous degassing device is mounted in the compartment II which is additionally arranged between the smelting furnace and the heat preserving furnace, so that degassing and deoxidizing effects can be fully guaranteed, and stability of liquid level of the heat preserving furnace can be further guaranteed. Oxygen-free copper produced by the device and the method is low in oxygen content and high in conductivity, the oxygen content is smaller than or equal to 5ppm, and the conductivity is larger than or equal to 101% of IACS (international annealed copper standard).

Description

technical field [0001] The invention relates to a high-purity and high-conductivity copper material continuous melting device and method, belonging to the technical field of non-ferrous metal casting. Background technique [0002] Oxygen-free copper is widely used in the fields of electrical engineering, electronics, communication and electric vacuum devices because of its high electrical conductivity, high thermal conductivity, good resistance to hydrogen embrittlement, excellent processing performance and welding performance. However, when copper is smelted at high temperature, it is easy to "inhale", and combines with oxygen to form cuprous oxide. After solidification and crystallization, cuprous oxide is distributed at the grain boundary. The increase of oxygen content in copper will reduce the conductivity of copper, which cannot reach 100. % of electrical conductivity. [0003] Oxygen-free copper has strict requirements on oxygen content. If the oxygen content is high...

AI Technical Summary

Problems solved by technology

[0004] 1. Generate Cu with copper 2 O brittle phase, forming Cu-Cu 2 O eutectic, distributed on the grain boundary in a network structure, resulting in a decrease in the mechanical properties of the copper rod, which is prone to fracture in subsequent processing

[0005] 2. Lead to a decrease in the conductivity of the oxygen-free copper rod

However, this method can only limit the oxygen content to about 10ppm, and cannot reduce it to below 5ppm.

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