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Capacitor structure and manufacturing method thereof

A technology of capacitor structure and manufacturing method, applied in capacitors, electrolytic capacitors, solid electrolytic capacitors, etc., can solve problems such as high-cost heat treatment equipment, increase construction costs, etc., and achieve the effect of improving conductivity and reducing heat treatment temperature.

Inactive Publication Date: 2014-06-25
CAP TAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. High-cost heat treatment equipment must be used;
[0008] 2. Need to increase construction cost

Method used

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  • Capacitor structure and manufacturing method thereof
  • Capacitor structure and manufacturing method thereof
  • Capacitor structure and manufacturing method thereof

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Embodiment Construction

[0050] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

[0051] see figure 2Shown is a schematic cross-sectional view of the capacitor structure of the present invention. The capacitor structure 20 includes: a first conductor layer 30 having a first metal material 31 and a second metal material 32, and the first conductor layer 30 is covered with On the surface of a first external terminal 33, a gap is formed between the first metal material 31, and the second metal material 32 is disposed at the gap position and formed on the surface of the first external terminal 33, and the first metal material 32 is formed on the surface of the first external terminal 33. A dielectric layer 40 is formed on the metal material 31, and a solid electrolyte layer 41 and a graphite layer 42 are sequentially arranged on the dielectric layer 40. The graphit...

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Abstract

The invention provides a capacitor structure and the manufacturing method thereof. The capacitor structure includes a first conductor layer, a dielectric layer and a second conductor layer, wherein the first conductor is provided with a first metal material and a second metal material, clearances are formed in the first metal material and filled with the second metal material through hot melting; therefore, the first conductor layer can effectively lower heat treatment temperature through the mutual hot melting relationship between the first metal material and the second metal material, and the capacitor structure also achieves the effects of improving electrical conductivity and enhancing whole intensity at the same time.

Description

technical field [0001] The invention relates to a capacitor structure and a manufacturing method thereof, in particular to a capacitor structure and a manufacturing method thereof which use combined composite materials to increase conductivity and reduce heat treatment temperature. Background technique [0002] In recent years, for electronic integrated circuits, it is required to operate at lower voltage, higher frequency, and lower noise. For solid electrolytic capacitors, for the reduction of ESR (equivalent series resistance), ESL (equivalent series inductance) Inductance) reduction requirements are also increasing. Metal powders suitable for anode materials of solid electrolytic capacitors include, for example, tantalum, niobium, titanium, tungsten, and molybdenum. Among them, capacitors using tantalum are rapidly spreading as parts of cell phones, personal computers, and the like due to their low ESR and large capacitance. Recently, higher capacity and lower ESR of c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/15H01G9/042
Inventor 刘元文
Owner CAP TAN TECH
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