Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application

A technology of LED encapsulation and encapsulation method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as difficulties in realization, achieve high optical requirements and performance, and improve the effect of light extraction efficiency

Inactive Publication Date: 2012-07-11
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with conformal coating, the light extraction efficiency of phosphor away from coating is higher, but its realization is more difficult
At home and abroad, research on remote coating of phosphor powder in LEDs has been carried out. Optical simulations have confirmed that remote coating can effectively improve the light extraction efficiency of LEDs, and a variety of ideal phosphor geometries have been proposed; but these works are only through simulation. There is no mature technology for industrial LED packaging, so finding a simple, low-cost LED phosphor away from the coating technology is crucial for LED packaging. important

Method used

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  • Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application
  • Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application
  • Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] see figure 1 The LED chip 1 is fixed on the package substrate 3 by solder, and the gold wire 2 connects the LED chip 1 with the package substrate 3 to form a continuous circuit. After the traditional hemispherical primary lens 5 is installed on the substrate, it is filled with silica gel 4 . Install the secondary lens 7 on the packaging substrate 3 , and then fill the phosphor glue 6 between the primary lens 5 and the secondary lens 7 . The inner surface of the secondary lens 7 is also hemispherical, and the thickness of the phosphor glue 4 is the difference between the radius of the inner surface of the secondary lens and the radius of the outer surface of the primary lens, so that the fluorescent powder far away from the coating with uniform thickness can be obtained. Powder glue layer.

[0029] see figure 2 and image 3 , the process of filling phosphor glue 6 between the primary lens 5 and the secondary lens 7 is: inject the phosphor glue 6 in the syringe 9 fro...

Embodiment 2

[0039] see Figure 5 and Figure 6 , the difference between this embodiment and Embodiment 1 is that the inner surface of the secondary lens 7 is not hemispherical, but semi-ellipsoidal, and the thickness of the fluorescent powder glue obtained away from the coating is not uniform, but the phosphor powder glue The top thickness is small and the bottom thickness is large. The advantage of doing this is: according to the light-emitting principle of white light LED, when the blue light from LED chip 1 passes through the phosphor powder glue 6, part of the blue light will be absorbed by the phosphor powder and converted into yellow light. The yellow light converted by the phosphor is mixed to obtain white light. However, the blue light emitted by the LED chip 1 conforms to the Lambertian distribution characteristics, the light intensity at the top is the largest, and gradually decreases with the increase of the angle, while the phosphor particles have scattering characteristics,...

Embodiment 3

[0041] see Figure 7 and Figure 8 The difference between this embodiment and Embodiment 1 is that the inner surface of the secondary lens 7 is not hemispherical, and its cross section is rectangular or trapezoidal or other shapes whose inner surface top surface is a plane; the outer surface of the primary lens 5 It is a hemisphere or other shapes with a flat top surface. The advantage of this is that the flat phosphor glue with uniform or non-uniform thickness can be kept away from the coating layer.

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Abstract

The invention belongs to the light emitting diode (LED) packaging technology, and relates to a packaging method for realizing separation of fluorescent powder glue away from coating in LED package and an application of the method. The method is characterized in that: fluorescent powder glue is filled inside a gap between a primary lens and a secondary lens in the LED package, the thickness of the fluorescent powder glue is adjusted according to the size of the gap between the primary lens and the secondary lens to realize the uniform or nonuniform thickness. The primary lens can be semispherical or rectangular, or can be a free curved surface with internal top being a plane; and the outer surface of the secondary lens can be a free curved surface, and the inner surface of the secondary lens can be a semispherical shape, a rectangular shape, a trapezoid shape or other shapes with the top part being a plane. The packaging method can be used for controlling the geometric shape of the fluorescent powder layer in the LED package. Due to the adoption of the packaging method, the fluorescent powder glue can be away from the coating, and at the same time, the LED can satisfy the optical requirements such as brightness uniformity, high light emission efficiency, and uniformity of color temperature control and color control.

Description

technical field [0001] The invention belongs to the LED packaging technology, and relates to a packaging method for realizing phosphor powder glue away from coating in LED packaging and an application thereof, in particular to the control of the phosphor layer morphology of the phosphor powder glue in LED packaging away from coating. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optic conversion efficiency, long service life, environmental protection and energy saving, and small size. It is known as the 21st century green lighting source. If it can be applied to the field of traditional lighting, it will have a very significant energy-saving effect, which is of great significance in today's increasingly tense global energy sources. With the breakthrough of the third-generation semiconductor material technology represented by ni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 罗小兵胡润郑怀付星刘胜
Owner HUAZHONG UNIV OF SCI & TECH
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