Manufacturing method and manufacturing device of superhard abrasive fret saw

Abstract

The invention discloses a superhard abrasive fret saw, a manufacturing method of the superhard abrasive fret saw, and a manufacturing device of the superhard abrasive fret saw. The manufacturing method of the superhard abrasive fret saw comprises the following steps: (1) a metal wire passing through a superhard abrasive coating device, and leading the surface of the metal wire to be sticked with superhard abrasive; and (2) the metal wire with the surface sticked with the superhard abrasive passing through a rolling device which is in rolling, wherein the rolling device comprises at least one group of rolling wheels, each group of rolling wheels comprise at least two rolling wheels; a ring groove is arranged on the wheel surface of each rolling wheel, the cross sections of the rolling wheels together form a whole forming hole used for forming the fret saw, and the metal wire with the surface sticked with the superhard abrasive is subjected to at least one round of rolling so as to lead the superhard abrasive to be rolled to the surface of the metal wire and form the superhard abrasive fret saw with a uniform diameter. According to the invention, the forming hole of the rolling device leads the superhard abrasive to the surface of the metal wire through the rolling, so that the superhard abrasive fret saw with a uniform diameter and high precision can be produced fast.

Description

technical field [0001] The invention relates to a processing device for brittle and hard materials, in particular to a superabrasive wire saw for precise cutting of brittle and hard materials, its manufacturing method and its manufacturing equipment. Background technique [0002] Due to their high hardness and high brittleness, brittle and hard materials such as silicon crystals, sapphire, and ceramics are prone to chipping and damage during cutting, resulting in damage to the material and reducing the yield. The methods currently used to cut brittle and hard materials such as silicon crystals are mainly free abrasive wire saw cutting, band saw cutting and diamond wire saw cutting. The principle of free abrasive cutting is to use the rapid movement of the steel wire to bring the abrasive-containing liquid into the slit of the workpiece to produce a cutting effect. It is the grinding between the steel wire, abrasive and workpiece. Mixed, the commonly used abrasive is silicon...

AI Technical Summary

Problems solved by technology

The diameter of the diamond coating of the diamond wire saw prepared by this process is uniform; however, due to the uneven pressure of the flat platen on the wire during the rolling process, the force on the abrasive on the wire is uneven, which cannot control the abrasive being pressed into the wire. The depth of the wire saw is uneven in thickness and wire diameter; and due to the rotation of the wire body during the rolling process, it is difficult to produce a diamond wire saw longer than 120 meters.

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