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Solvent-free epoxy resin as plugging material, and preparation method and application of the solvent-free epoxy resin

A technology of epoxy resin and plugging material, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of low consolidation strength, insufficient work, etc., to reduce energy consumption, reduce toxicity, shorten reaction time and The effect of dehydration time

Active Publication Date: 2012-07-25
GUANGZHOU CHEM GROUTING CO LTD CAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is still not enough work done on how to improve the bonding and curing properties of epoxy resin materials at wet interfaces, especially in water.
[0005] Invention patent 200910233195.3 discloses a plugging waterproof sticker, which has good drainage and waterproof effects, but its consolidation strength is not high

Method used

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  • Solvent-free epoxy resin as plugging material, and preparation method and application of the solvent-free epoxy resin
  • Solvent-free epoxy resin as plugging material, and preparation method and application of the solvent-free epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] (1) Synthesis of organosilicon-modified epoxy compounds

[0057] Add 255.0g of benzyl glycidyl ether into a closed reactor, blow nitrogen into it, heat to 85°C, add dropwise the mixed solution prepared by 44.4g of hydroxy silicone oil and 0.6g of catalyst benzyltriethylammonium chloride under stirring , after the dropwise addition, the temperature was raised to 130° C. to continue the reaction for 4 hours, and cooled to obtain 300.0 g of organosilicon-modified epoxy compounds;

[0058] (2) Synthesis of Pluronic polyol polyether modified epoxy resin

[0059] Add 224.4g of epoxy resin E-51 into a closed reactor, blow nitrogen into it, heat to 80°C, add dropwise 75.0g of Pluronic polyol polyether L under stirring 35 With the mixed solution of 0.6g catalyst benzyltriethylammonium chloride preparation, be warming up to 120 ℃ and continue to react for 3 hours after dropwise addition, cooling, obtain 300.0g Pluronic polyol polyether modified epoxy resin;

[0060] (3) Prepara...

Embodiment 2

[0067] (1) Synthesis of organosilicon-modified epoxy compounds

[0068] Add 264.0g of benzyl glycidyl ether into the closed reactor, blow in nitrogen gas, heat to 85°C, and add dropwise the mixed solution prepared by 35.4g of hydroxyl silicone oil and 0.6g of catalyst benzyltriethylammonium chloride under stirring , after the dropwise addition, the temperature was raised to 130° C. to continue the reaction for 4 hours, and cooled to obtain 300.0 g of organosilicon-modified epoxy compounds;

[0069] (2) Synthesis of Pluronic polyol polyether modified epoxy resin

[0070] Add 239.4g of epoxy resin E-51 into the closed reactor, blow in nitrogen, heat to 80°C, add dropwise 60.0g of Pluronic polyol polyether L under stirring 35 With the mixed solution of 0.6g catalyst benzyltriethylammonium chloride preparation, be warming up to 120 ℃ and continue to react for 3 hours after dropwise addition, cooling, obtain 300.0g Pluronic polyol polyether modified epoxy resin;

[0071] (3) Prep...

Embodiment 3

[0078] (1) Synthesis of organosilicon-modified epoxy compounds

[0079] Add 270.0g of benzyl glycidyl ether into a closed reactor, blow nitrogen into it, heat to 85°C, add dropwise the mixed solution prepared by 28.8g of hydroxyl silicone oil and 1.2g of catalyst benzyltriethylammonium chloride under stirring , after the dropwise addition, the temperature was raised to 130° C. to continue the reaction for 4 hours, and cooled to obtain 300.0 g of organosilicon-modified epoxy compounds;

[0080] (2) Synthesis of Pluronic polyol polyether modified epoxy resin

[0081] Add 254.1g of epoxy resin E-44 into the closed reactor, blow in nitrogen, heat to 80°C, add dropwise 45.0g of Pluronic polyol polyether L under stirring 44 With the mixed solution of 0.9g catalyst benzyltriethylammonium chloride preparation, be warming up to 120 ℃ and continue to react for 3 hours after dropwise addition, cooling, obtain 300.0g Pluronic polyol polyether modified epoxy resin;

[0082] (3) Preparati...

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Abstract

The invention discloses a solvent-free epoxy resin as a plugging material and a preparation method and application of the solvent-free epoxy resin. The material is prepared from part A and part B at a ratio of 4:1 to 20:1 by weight, wherein the part A contains the following components by weight: 7.3-13.8% of organic silicon modified epoxy compound, 66.2-70.8% of Pluronic polyol polyether-modified epoxy resin, 15.0-25.0% of a reactive diluent, and 0.2-0.5% of a catalyst A, and part B contains the following components by weight: 99.0-99.7% of modified phenolic amine, 0.2-0.5% of a silicane coupling agent and 0.1-0.5% a catalyst B. According to the invention, reaction between benzyl glycidyl ether and hydroxyl silicone oil is utilized, so that the molecular weight of the reaction product is reduced, the viscosity is reduced, and the surface tension of the product is small for plugging effect. In addition, reaction between Pluronic polyol polyether and epoxy resin is adopted to improve the elasticity of a consolidating body and increase the surface activity of the system for water repelling effect. The solvent-free epoxy resin as the plugging material can be applied to engineering parts with visible water.

Description

technical field [0001] The invention belongs to the field of building materials, in particular to a solvent-free epoxy resin plugging material and its preparation method and application. Background technique [0002] At present, the waterproof and plugging materials used in underground projects, tunnels, dams, oil fields, etc., mostly use chemical grouting materials such as single-component water-soluble polyurethane, acrylate and acrylic. These slurries have a certain water-absorbing and swelling function. After being solidified in the crack, the consolidated body can expand repeatedly when it encounters water, so as to achieve the effect of water-stopping and leak-stopping. However, due to the relatively low strength and poor salt resistance of these slurries after consolidation, they are not suitable for application in building reinforcement. [0003] The molecular structure of epoxy resin contains unique epoxy groups, hydroxyl groups, ether bonds and other active groups...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/06C08L61/34C08G77/38C08G59/14C08G14/073C08G59/40C09K3/12
Inventor 杨元龙徐宇亮张亚峰陈雪亮张维欣
Owner GUANGZHOU CHEM GROUTING CO LTD CAS
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