Cold rolling manufacture method of copper and aluminum composite plate strips
A technology of copper-aluminum composite plate and manufacturing method, which is applied in the direction of metal rolling, metal rolling, manufacturing tools, etc., can solve problems such as lack of bonding strength and incomplete realization of transition structure, and achieve the effect of improving bonding strength
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Embodiment 1
[0028] The present embodiment is a cold-rolled manufacturing method of a copper-aluminum composite strip, which has the following steps successively:
[0029] ① Homogenized annealing treatment of copper and aluminum plates: put the copper plate in the annealing furnace and keep the temperature at 450°C for 30 minutes; put the aluminum plate in the annealing furnace and keep the temperature at 280°C for 30 minutes;
[0030] ②Surface treatment: First, immerse and degrease the copper and aluminum plates after homogenization annealing treatment, then take out the leached copper and aluminum plates and dry them, and then polish the composite surfaces of the copper and aluminum plates to be rolled with a stainless steel wire brush, so that It is better to leave brush marks on the composite surface of the copper plate and the aluminum plate or feel similar to the frosted effect; the specific dipping method is: use 10% H for the copper plate after homogenization annealing 2 SO 4 Solu...
Embodiment 2
[0034] Example 2 is basically the same as Example 1, except that in step ①, the copper plate is placed in the annealing furnace, and the temperature is maintained at 460°C for 30 minutes; the aluminum plate is placed in the annealing furnace, and the temperature is maintained at 290°C for 30 minutes. 30 minutes;
[0035]In step ③, the thickness of the copper plate used in this embodiment is 0.8 mm, and the thickness of the aluminum plate is 4 mm, that is, the ratio of the thickness of the aluminum plate to the thickness of the copper plate is 5, and the reduction is 50%;
[0036] In step ④, the diffusion annealing temperature is 470° C., and the annealing time is 20 minutes.
Embodiment 3
[0038] Example 3 is basically the same as Example 1, except that in step ①, the copper plate is placed in the annealing furnace, and the temperature is maintained at 470°C for 30 minutes; the aluminum plate is placed in the annealing furnace, and the temperature is maintained at 300°C for 30 minutes. 30 minutes;
[0039] In step 3., the thickness of the copper plate used in this embodiment is 0.8 millimeters, and the thickness of the aluminum plate is 8 millimeters, that is, the ratio of the thickness of the aluminum plate to the thickness of the copper plate is 10, and the reduction is 50%;
[0040] In step ④, the diffusion annealing temperature is 500° C., and the annealing time is 15 minutes.
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