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Preparation method of light emitting diode (LED) fluorescent powder layer

A phosphor layer and phosphor technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of unstable physical and chemical properties of devices, poor photothermal stability of organic components, etc., and achieve high repeatability and mass production. The effect of performance consistency

Inactive Publication Date: 2012-08-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The problem to be solved by the present invention is how to use the new powder-slurry process to realize the conformal coating of LED phosphor powder, and to solve the problem in the prior art due to the low photothermal stability of the organic components in the LED phosphor powder coating. The physical and chemical properties of the device are unstable due to poor

Method used

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  • Preparation method of light emitting diode (LED) fluorescent powder layer
  • Preparation method of light emitting diode (LED) fluorescent powder layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Take polyvinyl alcohol (PVA), photosensitizer chromium trioxide (CrO3), phosphor particles, and deionized water and mix evenly to form a stable dispersion of phosphor particles in photosensitive adhesive PVA.

[0043] The phosphor powder photosensitive adhesive dispersion is evenly coated on the surface of the LED chip in the light emitting direction by a glue dispensing method.

[0044] Connect the positive and negative poles of the LED chip, and use the self-luminescence of the chip to realize the self-exposure process of the photosensitive adhesive. After hot water development, the corresponding phosphor powder photosensitive adhesive coating is obtained on the surface of the LED chip in the light emitting direction.

[0045] Put the LED chip with phosphor powder photosensitive adhesive coating into the plasma deglue equipment, and use the method of oxygen plasma bombardment to remove the organic components in the photosensitive adhesive.

Embodiment 2

[0047] Take polyvinyl alcohol (PVA), photosensitizer ammonium dichromate (ADC) and chromium trioxide (CrO3), phosphor, deionized water and mix evenly to form a stable dispersion of particles containing phosphor in photosensitive adhesive PVA .

[0048] The phosphor powder photosensitive adhesive dispersion is evenly coated on the surface of the LED chip in the light emitting direction by a glue dispensing method.

[0049] Connect the positive and negative poles of the LED chip, and use the self-luminescence of the chip to realize the self-exposure process of the photosensitive adhesive. After hot water development, the corresponding phosphor powder photosensitive adhesive coating is obtained on the surface of each LED chip in the light-emitting direction.

[0050] Put the LED chip with phosphor powder photosensitive adhesive coating into the plasma deglue equipment, and use the method of oxygen plasma bombardment to remove the organic components in the photosensitive adhesive....

Embodiment 3

[0052] Mix polyvinyl alcohol (PVA), photosensitizer ammonium dichromate (ADC) and chromium trioxide (CrO3), phosphor, low-melting glass powder and deionized water to form stable particles containing phosphor in PVA dispersion.

[0053] The phosphor powder photosensitive adhesive dispersion is coated on the surface of the blue LED chip in the light emitting direction by a dispensing method.

[0054] Connect the positive and negative poles of the LED chip, and use the self-luminescence of the chip to realize the self-exposure process of the photosensitive adhesive. After hot water development, a phosphor powder photosensitive adhesive coating is obtained on the light-emitting surface of the LED chip.

[0055] Put the LED chip coated with phosphor photosensitive glue into the heating furnace, heat it to a temperature exceeding the melting point of glass powder, and keep it for a period of time, and then cool down and take it out after the organic components in the photosensitive ...

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Abstract

The invention discloses a preparation method of a light emitting diode (LED) fluorescent powder layer and belongs to the field of photoelectricity. The preparation method comprises the following steps that: fluorescent powder particles, film forming agents, sensitisers and water are uniformly mixed according to a certain proportion, and fluorescent powder slurry of fluorescent powder photosensitive glue dispersion bodies is obtained; the fluorescent powder slurry is coated on the surface in the LED emergence direction, and the required fluorescent powder photosensitive glue dispersion body coating is formed; exposure and development are carried out, and the coating with required patterns is obtained; and organic ingredients in the fluorescent powder photosensitive glue dispersion body coating are removed, and the fluorescent powder layer with the definite patterns is obtained. A novel water soluble photosensitive glue system and the coating glue removing modified technology are adopted, the application values are particularly realized in the preparation process of the pc-LED white light LEDs, the preparation method can be applied to the LED chip level encapsulation and can also be used for the wafer level coating encapsulation, then, the chip cutting and encapsulation are carried out, and higher repeated operability and volume production performance consistency are realized.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a method for preparing an LED phosphor layer. Background technique [0002] LED is the abbreviation of light emitting diode. In 1993, blue GaN light-emitting diodes made technological breakthroughs, and white LEDs were realized in 1996. At present, white LED-based semiconductor lighting sources have established their status as the third-generation lighting technology after incandescent lamps and fluorescent lamps. It is an inevitable trend in the development of lighting technology in the future. White LED has the advantages of low voltage drive, low power consumption, high reliability, long life, etc. It is a green lighting source that conforms to the concept of environmental protection and energy saving. Therefore, its research and development has attracted great enthusiasm and great attention from governments and many business companies. [0003] White light can be r...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 饶海波王玮万贤龙周琳淞廖骏源
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA