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Organic silicon epoxy resin curing agent and epoxy curing system containing same

A technology of silicon epoxy resin and epoxy resin, which is applied in the field of epoxy curing system and silicone epoxy resin curing agent, can solve the problem of affecting the surrounding amino groups, large siloxane chain segments, and poor mechanical properties. Ideal and other issues, to achieve the effect of outstanding bonding performance and bending strength, wide application, and high dielectric strength

Active Publication Date: 2014-06-25
HANGZHOU ZHIJIANG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of curing agent improves the dielectric properties of the epoxy resin, but due to the large volume of the siloxane chain segment, it affects the surrounding amine groups to participate in the curing reaction, and its mechanical properties are not ideal.

Method used

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  • Organic silicon epoxy resin curing agent and epoxy curing system containing same
  • Organic silicon epoxy resin curing agent and epoxy curing system containing same
  • Organic silicon epoxy resin curing agent and epoxy curing system containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Using dichloromethyltetrasiloxane as raw material, it is directly added dropwise into ethylenediamine under stirring, the reaction temperature is controlled at 60-70°C, and the reaction time is 3h. After the reaction, the upper organic layer was separated and distilled under reduced pressure, and the fraction collected at 180-182° C. was the silicone epoxy resin curing agent represented by the above formula (1), with a yield of 93%.

[0048]Get 100 parts by weight of E-44 epoxy resin, 8 parts by weight of curing agent shown in formula (1), 0.4 parts by weight of 2-methylimidazole, stir for 1.5-2 hours and mix evenly, according to GB-T7124-1986 (adhesive tensile Shear strength test method) evenly spread on the surface of the steel sheet cleaned with acetone and fixed, cured at 80°C for 30 minutes, and cured at 150°C for 1.5 hours. The bond strength was tested to be 11.3MPa, and the tensile modulus at the bond was 2840MPa.

[0049] Stir the resin, curing agent, and curin...

Embodiment 2

[0051] Using dichloromethyltetrasiloxane as raw material, it is directly added dropwise into p-phenylenediamine under stirring, the reaction temperature is controlled at 60-70°C, and the reaction time is 3h. After the reaction, the upper organic layer was separated and distilled under reduced pressure, and the fraction collected at 210-212° C. was the silicone epoxy resin curing agent represented by the above formula (2), with a yield of 94%.

[0052] Get 100 parts by weight of E-51 epoxy resin, 10 parts by weight of curing agent shown in formula (2), 0.4 parts by weight of triethanolamine, stir for 1.5-2 hours and mix evenly, according to GB-T7124-1986 (adhesive tensile shear strength Test method) Evenly spread on the surface of the steel sheet cleaned with acetone and fix it, cure at 80°C for 30 minutes, and cure at 150°C for 1.5 hours. The bond strength was tested to be 13.2MPa, and the tensile modulus at the bond was 2720MPa.

[0053] Stir the resin, curing agent, and cur...

Embodiment 3

[0055] Using dichloromethyldisiloxane as a raw material, it is directly added dropwise into ethylenediamine under stirring, the reaction temperature is controlled at 60-70°C, and the reaction time is 3h. After the reaction, the upper organic layer was separated and distilled under reduced pressure, and the fraction collected at 160-162° C. was the silicone epoxy resin curing agent shown in formula (3), with a yield of 96%.

[0056] Take 100 parts by weight of E-39 epoxy resin, 10 parts by weight of curing agent shown in formula (3), 0.3 parts by weight of 2-methyl-4-ethylimidazole, stir for 1.5-2 hours and mix well, according to GB-T7124- 1986 (Test Method for Tensile Shear Strength of Adhesives) Spread evenly on the surface of a steel sheet cleaned with acetone and fix it, cure at 80°C for 30 minutes, and cure at 150°C for 1.5 hours. Its bonding strength is tested to be 10.2MPa, and the tensile modulus of the bonded part is 2250MPa.

[0057] Stir the resin, curing agent, and...

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Abstract

The invention discloses an organic silicon epoxy resin curing agent and an epoxy curing system containing the same. The curing agent can be used for curing various kinds of epoxy resin such as glycidyl ether epoxy resin, aliphatic epoxy resin and glycidyl ester epoxy resin. The curing agent is stable and difficult to volatilize; and a material obtained after the curing agent is cured with the epoxy resin does not have bubbles, has a smooth surface, has excellent electric performance and mechanical property and predominant impact resistance and thermal stability, and is applied in the field of high additional value of epoxy molding compounds for electronic encapsulation and the like.

Description

technical field [0001] The invention relates to the application field of epoxy resin, in particular to a silicone epoxy resin curing agent and an epoxy curing system containing it. Background technique [0002] Epoxy resins have developed into a large class of thermosetting resins due to their excellent mechanical and electrical properties and are widely used in adhesives, structural composite materials, electronic semiconductor packaging and other fields. Among them, the curing agent has a greater influence on its performance. Nowadays, the widely used curing agents are mainly amine curing agents, but low-molecular-weight amine substances such as ethylenediamine have the disadvantage of being volatile, which will cause great harm to the construction personnel, and the epoxy resin cured by this amine substance The impact resistance of the resin is poor, and the crosslink density is difficult to adjust, which limits the application of epoxy resin in high-tech fields. [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C07F7/10C08G59/20
Inventor 范宏李诚余明新李伯耿
Owner HANGZHOU ZHIJIANG NEW MATERIAL CO LTD
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