Heat conducting resin coated copper foil, manufacturing method of heat conducting resin coated copper foil and application of heat conducting resin coated copper foil to aluminum substrate manufacturing process

Abstract

The invention provides heat conducting resin coated copper foil, a manufacturing method of the heat conducting resin coated copper foil and an application of the heat conducting resin coated copper foil to an aluminum substrate manufacturing process. The heat conducting resin coated copper foil comprises a copper foil layer (1), a heat conducting adhesive film layer (2) and a parting film layer (3), wherein the copper foil layer (1), the heat conducting adhesive film layer (2) and the parting film layer (3) are overlapped in sequence; in the process of manufacturing the heat conducting resin coated copper foil, a copper foil roll is unrolled, a heat conducting adhesive film is coated on one surface of the copper foil and then dried, and finally, a parting film is laminated on the heat conducting adhesive film so as to obtain the heat conducting resin coated copper foil; and during manufacturing an aluminum substrate with the heat conducting resin coated copper foil, an aluminum plate is cut and treated, the heat conducting resin coated copper foil is unrolled, the parting film layer on the heat conducting resin coated copper foil is removed, the aluminum plate is pressed on the heat conducting resin coated copper foil, then a protective film is laminated on the external side of the aluminum plate, and the heat conducting resin coated copper foil and the protective film are cut according to the size of the aluminum plate, and finally, an aluminum substrate finished product is obtained. The heat conducting resin coated copper foil provided by the invention can be used in the making field of the aluminum substrates.

Description

technical field [0001] The invention relates to a heat-conducting adhesive-backed copper foil, a production method of the heat-conducting adhesive-backed copper foil and an application of the heat-conducting adhesive-backed copper foil in an aluminum substrate production process. Background technique [0002] The development of LED technology is getting faster and faster. The aluminum substrate has good thermal conductivity, electrical insulation performance and mechanical processing performance. Compared with the traditional FR-4, the aluminum substrate adopts the same thickness and the same line width. The aluminum substrate can carry higher current and the aluminum substrate can withstand voltage. Up to 4500V, thermal conductivity greater than 2.0. Therefore, in LED technology, the aluminum substrate is the main receiving board for making LED products. The aluminum substrate is divided into two sides, the white side is for soldering the LED pins, and the other side show...

AI Technical Summary

Problems solved by technology

It can be seen that in the existing production process, two layers of release film need to be attached and then removed. This method not only increases the input cost of the release film, but also increases the process steps in the production process of the aluminum substrate. Increased the complexity of the process, but also enhanced the labor intensity of the staff

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