Low-capacity metal packaged silicon transient voltage suppressor and manufacturing method thereof
A technology of transient voltage suppression and metal packaging, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as high-frequency signal distortion, signal distortion, etc., to solve large junction capacitance, low junction capacitance, production low cost effect
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0026] Such as figure 1 As shown, the present invention provides a kind of manufacturing method of low-capacity metal packaging silicon transient voltage suppressor diode, and it comprises the steps:
[0027] Step 1, Diffusion: Select a suitable P-type single crystal silicon wafer and an N-type single crystal silicon wafer for rectifier diode chips according to the required breakdown voltage of the transient voltage suppression diode chip, and thin the single cryst...
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