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Super-abrasive grain wheel, wafer manufacturing method using same, and wafer

A kind of abrasive grain and super technology, which is applied in the direction of manufacturing tools, bonded grinding wheels, and machine tools suitable for grinding workpiece planes. It can solve problems such as unstable rotation, achieve good sharpness, good processing surface quality, and prevent accumulation Effect

Active Publication Date: 2012-10-03
ALLIED MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In Patent Document 2, in order to solve the above-mentioned problems, the technology of forming a liquid accumulation place open radially inward on the inner periphery of the base is disclosed. However, when too much grinding fluid is accumulated in the liquid accumulation place, if High-speed rotation, there is a problem of unstable rotation

Method used

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  • Super-abrasive grain wheel, wafer manufacturing method using same, and wafer
  • Super-abrasive grain wheel, wafer manufacturing method using same, and wafer
  • Super-abrasive grain wheel, wafer manufacturing method using same, and wafer

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Effect test

Embodiment approach 1

[0112] figure 1 It is a front view of the superabrasive grinding wheel in Embodiment 1 of this invention. figure 2 It is a top view of the superabrasive grinding wheel in Embodiment 1 of this invention. image 3 It is a bottom view of the superabrasive grinding wheel in Embodiment 1 of this invention. Figure 4 is along image 3 Sectional view of line IV-IV in. Figure 5 is along image 3 The cross-sectional view of the V-V line in. Image 6 will be Figure 4 The enlarged cross-sectional view of the part enclosed by line VI-VI in . Figure 7 will be Figure 5 The enlarged cross-sectional view of the part surrounded by line VII-VII in . Figure 8 It is a perspective view of one surface of the superabrasive grinding wheel according to Embodiment 1 of the present invention. Figure 9 It is a perspective view of the other surface of the superabrasive grinding wheel in Embodiment 1 of this invention.

[0113] refer to Figure 1 to Figure 9 , The superabrasive grinding w...

Embodiment approach 2

[0122] Figure 10 It is a bottom view of the superabrasive grinding wheel in Embodiment 2 of this invention. refer to Figure 10 , in the superabrasive grinding wheel 1 of Embodiment 2 of the present invention, the action surface shape of the superabrasive layer 20 is approximately a parallelogram, which is similar to that of the superabrasive layer 20 in the first embodiment in which the shape of the superabrasive layer 20 is approximately rectangular. The grit wheels are different.

[0123] The superabrasive wheel of Embodiment 2 comprised in this way also has the effect similar to the superabrasive wheel of Embodiment 1.

Embodiment approach 3

[0125] Figure 11 It is a bottom view of the superabrasive grinding wheel in Embodiment 3 of this invention. Figure 12 is along Figure 11 Sectional view of line XII-XII in. Figure 13 is along Figure 11 Sectional view of line XIII-XIII in. Figure 14 will be Figure 12 Figure in enlarged representation of a portion of the base piece surrounded by XIV-XIV. Figure 15 will be Figure 13 An enlarged cross-sectional view of a portion surrounded by line XV-XV in . Figure 16 It is a perspective view of one surface of a superabrasive grinding wheel according to Embodiment 3 of the present invention. Figure 17 It is a perspective view of the other surface of the superabrasive grinding wheel in Embodiment 3 of this invention. With reference to said figure, in the superabrasive grinding wheel according to Embodiment 3 of the present invention, the first vertical wall 111, the first inverted tapered surface 112, the second vertical wall 116, the second vertical wall 111, the...

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Abstract

Provided is a super-abrasive grain wheel such that grinding fluid can be uniformly dispersed and that stable rotation can be achieved. The super-abrasive grain wheel (1) is equipped with a base metal block (10) which rotates about a rotation shaft, and super-abrasive grain layers (20) which are firmly fixed to the base metal block (10). The base metal block (10) comprises a first surface (201), and a second surface (202) which is located on the opposite side to the first surface (201). A first protrusion (121) which is annular and projects in a direction moving away from the first surface (201) is provided in a portion of the second surface (202), said portion being an area surrounded by the super-abrasive grain layers (20). A reference surface (110) is provided in a portion of the second surface (202), said portion being inward from the first protrusion (121). The height from the reference surface (110) to the first protrusion (121) is denoted by A. A top section (114) having a height of B as measured from the reference surface (110) is provided in a portion of the second surface (202), said portion being an area between the first protrusion (121) and the super-abrasive grain layers (20). The height B is larger than the height A.

Description

technical field [0001] The present invention relates to a superabrasive grinding wheel, a method for manufacturing a wafer using the super abrasive grinding wheel, and a wafer, more specifically, to a grinding wheel having a super abrasive grain layer. Background technique [0002] Conventionally, grinding wheels are disclosed in, for example, JP-A-7-31268 (Patent Document 1) and JP-A-2003-19671 (Patent Document 2). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Publication No. 7-31268 [0006] Patent Document 2: Japanese Patent Laid-Open No. 2003-19671 [0007] Patent Document 1 discloses a grinding stone capable of sufficiently supplying a grinding fluid to a contact portion between a workpiece and a fan-shaped grindstone. Specifically, the grinding stone that grinds the surface of a semiconductor wafer or the like includes a fan-shaped grindstone and a holding member that holds the fan-shaped grindstone,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B55/02B24D7/10
CPCB24D7/10B24D7/06B24B7/228Y10T428/24355B24B55/02
Inventor 石津智广冈西幸绪熊泽照之
Owner ALLIED MATERIAL