Manufacture technology for high-frequency material

Abstract

The invention relates to a technology for reducing machinery processing problems of printed circuit boards by using a high-frequency material as a basic material. The high-frequency material at least comprises a copper foil, a teflon (polytetrafluoroethylene) resin, glass fiber, and the like, wherein the glass fiber is treated for reducing mechanical strength and is beneficial for processing when machining in subsequent manufacture processes. Materials produced by the method are not changed in material performance and not changed greatly in production cost. However, production yield and production capacity for the subsequently printing circuit boards are improved. The technology can play important role in the development of electronic industry.

Description

technical field [0001] Printed circuit board is the largest component in ordinary electronic products. It is a carrier that carries various electronic components and keeps them connected in a certain way, so as to realize the design and use functions of electronic products; IC package packaging The board is an important electronic component in the integrated circuit component. It is the carrier of the wafer, so that the connection between the wafers, and between the wafer and other electronic components is maintained in a certain way, so as to realize the integration of integrated circuit components. The device is designed to use the function. The most important raw materials of electronic components such as printed circuit boards and IC packaging substrates - copper clad laminates and prepregs are mainly composed of copper foil, resin, glass fiber cloth and other materials. If the resin is mainly made of materials such as Teflon Composition, it constitutes a special material...

AI Technical Summary

Problems solved by technology

However, the Teflon high-frequency material currently used is soft because the Teflon material itself is soft, and the Teflon material at the processed position is deformed during mechanical processing (including cutting, shearing, cutting, milling, drilling, planing, etc.) As a result, the glass fiber cannot be effectively cut off, but is subjected to the combined action of shearing and pulling, so the glass fiber is pulled out, resulting in uneven fracture of the glass fiber, hanging wire, and The occurrence of problems such as roughness, these problems lead to poor yield rate, and also affect the processing accuracy of printed circuit boards made of Teflon materials

Images