Graphite heat conduction high-powder flat plane light source encapsulation method

A planar light source and graphite heat conduction technology, which is applied in the direction of semiconductor devices, electrical components, electric solid devices, etc., can solve the problems that the temperature cannot be transmitted and dissipated in time, the accumulation of LED junction temperature rises, and the LED luminous rate decreases, etc., to achieve The effect of reducing component cost, rapid heat conduction, and improving light extraction rate

Inactive Publication Date: 2012-11-14
GUANGDONG DOER SCI & TECH
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The common and common manufacturing method of lighting fixtures is to package the LED chip in an independent device, and then weld it on the aluminum substrate. This manufacturing method has multi-layer joint surfaces and a long heat conduction distance, which makes the thermal resistance of heat dissipation too high. , when the LE

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Graphite heat conduction high-powder flat plane light source encapsulation method
  • Graphite heat conduction high-powder flat plane light source encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Example

[0026] like figure 1 , 2 As shown, the high-power planar light source packaging method of graphite heat conduction, the steps are as follows:

[0027] (1) Drill or cut the inverted trapezoidal crystal-bonded reflective cup reflective cavity (2) on the aluminum PCB (1) in a rectangular array or in any other special arrangement;

[0028] (2) Implanting single or multiple LED chips (3) into the reflective cavity (2);

[0029] (3) Draw a functional PCB circuit (4) around the reflective cavity (2);

[0030] (4) bonding the electrode lead (5) of the LED chip (3) to the functional circuit (4) of the aluminum PCB (1), and conducting the circuit;

[0031] (5) cutting, stamping or otherwise making an annular fence (6) around the single or multiple LED reflective cavity (2);

[0032] (6) Evenly apply molding silica gel (7) or fluorescent lamps containing YAG or any powder that can be excited by LEDs to cause color changes in the enclosure;

[0033] (7) Implanting t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a graphite heat conduction high-powder flat plane light source encapsulation method. The method comprises the following steps that a reverse trapezoidal solid crystal reflecting cup reflecting cavity (2) is drilled or cut on an aluminum PCB (printed circuit board) (1); single or multiple LED (light emitting diode) chips (3) are transplanted into the reflecting cavity (2), a functional PCB circuit (4) is drawn around the reflecting cavity (2); an electrode lead wire (5) of the LED chip (3) is bonded onto the functional circuit (4) of the aluminum PCB (1), and the circuit is conducted; annular surrounding grids (6) are made on the periphery of the single or a plurality of LED reflecting cavities (2) through cutting or punching or through adopting other modes; forming silicon rubber (7) or YAG(yttrium aluminum garne)-containing fluorescent lamps or any powder capable of realizing the color change through being stimulated is uniformly coated in the surrounding grids; the ductility of the aluminum material is utilized for transplanting heat conduction graphite sheets (8) into the integral aluminum base plate; and the integral LED flat plane light source is formed. According to the method provided by the invention, the graphite is creatively utilized to be used as heat conduction materials, and the heat transmission capability is enhanced.

Description

technical field [0001] The invention relates to a packaging technology for a planar LED light source, in particular to a method for packaging a high-power planar light source with graphite heat conduction. Background technique [0002] The common and common manufacturing method of lighting fixtures is to package the LED chip in an independent device, and then weld it on the aluminum substrate. This manufacturing method has multi-layer joint surfaces and a long heat conduction distance, which makes the thermal resistance of heat dissipation too high. , when the LED lights up to generate heat, the temperature will not be transmitted and dissipated in time, which will cause the LED junction temperature to rise and increase, so that the LED luminous rate will decrease, which will seriously cause LED damage. At the same time, excessive reliance on aluminum heat dissipation will cause product The cost is high. Contents of the invention [0003] The purpose of the present invent...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/00H01L33/48H01L33/64H01L25/075
CPCH01L2224/48091H01L2924/00014
Inventor 廖文军
Owner GUANGDONG DOER SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap