Graphite heat conduction high-powder flat plane light source encapsulation method

Abstract

The invention discloses a graphite heat conduction high-powder flat plane light source encapsulation method. The method comprises the following steps that a reverse trapezoidal solid crystal reflecting cup reflecting cavity (2) is drilled or cut on an aluminum PCB (printed circuit board) (1); single or multiple LED (light emitting diode) chips (3) are transplanted into the reflecting cavity (2), a functional PCB circuit (4) is drawn around the reflecting cavity (2); an electrode lead wire (5) of the LED chip (3) is bonded onto the functional circuit (4) of the aluminum PCB (1), and the circuit is conducted; annular surrounding grids (6) are made on the periphery of the single or a plurality of LED reflecting cavities (2) through cutting or punching or through adopting other modes; forming silicon rubber (7) or YAG(yttrium aluminum garne)-containing fluorescent lamps or any powder capable of realizing the color change through being stimulated is uniformly coated in the surrounding grids; the ductility of the aluminum material is utilized for transplanting heat conduction graphite sheets (8) into the integral aluminum base plate; and the integral LED flat plane light source is formed. According to the method provided by the invention, the graphite is creatively utilized to be used as heat conduction materials, and the heat transmission capability is enhanced.

Description

technical field [0001] The invention relates to a packaging technology for a planar LED light source, in particular to a method for packaging a high-power planar light source with graphite heat conduction. Background technique [0002] The common and common manufacturing method of lighting fixtures is to package the LED chip in an independent device, and then weld it on the aluminum substrate. This manufacturing method has multi-layer joint surfaces and a long heat conduction distance, which makes the thermal resistance of heat dissipation too high. , when the LED lights up to generate heat, the temperature will not be transmitted and dissipated in time, which will cause the LED junction temperature to rise and increase, so that the LED luminous rate will decrease, which will seriously cause LED damage. At the same time, excessive reliance on aluminum heat dissipation will cause product The cost is high. Contents of the invention [0003] The purpose of the present invent...

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Problems solved by technology

[0002] The common and common manufacturing method of lighting fixtures is to package the LED chip in an independent device, and then weld it on the aluminum substrate. This manufacturing method has multi-layer joint surfaces and a long heat conduction distance, which makes the thermal resistance of heat dissipation too high. , when the LED lights up to generate heat, the temperature will not be transmitted and dissipated in time, which will cause the LED junction temperature to rise and increase, so that the LED luminous rate will decrease, which will seriously cause LED damage. At the same time, excessive reliance on aluminum heat dissipation will cause product high cost

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