MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof
A technology of thin film capacitors and sensors, applied in the direction of using electric/magnetic devices to transfer sensing components, microstructure technology, electric solid devices, etc., can solve the problems of cumbersome process, large volume, cumbersome manufacturing process, etc., and achieve simple integration process, Effect of small size and cost reduction
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[0032] The present invention will be further described below with reference to the drawings and embodiments.
[0033] Such as Figure 7 As shown, the structure of the above-mentioned MEMS film capacitive multi-parameter sensor is adopted in this embodiment, which includes: the carrier substrate of the MEMS device 1, the MEMS film capacitive pressure sensor 2, the MEMS film capacitive temperature sensor 3, the MEMS film capacitive Humidity sensor 4; the above-mentioned three kinds of sensors are arranged on the supporting substrate 1 in parallel.
[0034] Such as Figure 7 As shown, the MEMS film capacitive pressure sensor 2 is provided with an upper electrode 7 and a lower electrode 5. The upper and lower electrodes form a parallel plate capacitance structure; the upper and lower electrodes are formed after the sacrificial layer 19 is released. The cavity 8 of the pressure sensor 2; the cavity 8 is film-sealed by a sealing layer 13 to keep the air pressure in the cavity 8 constant;...
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