MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof

A technology of thin film capacitors and sensors, applied in the direction of using electric/magnetic devices to transfer sensing components, microstructure technology, electric solid devices, etc., can solve the problems of cumbersome process, large volume, cumbersome manufacturing process, etc., and achieve simple integration process, Effect of small size and cost reduction

Active Publication Date: 2012-11-28
中科芯未来微电子科技成都有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In 2005, A. D. DeHennis and K. D. Wise of the University of Michigan integrated capacitive pressure, temperature and humidity sensors for a passive wireless sensor system, but the three sensors were manufactured separately, the process was cumbersome, and bulk silicon was used Processing technology, as well as the method of wafer bonding, the sensor products produced are relatively large; recently, in 2011, A. C. McNeil of Freescale Semiconductor Corporation and others successfully used capacitive pressure and temperature sensors manufactured by thin film technolo

Method used

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  • MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof
  • MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof
  • MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof

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[0032] The present invention will be further described below with reference to the drawings and embodiments.

[0033] Such as Figure 7 As shown, the structure of the above-mentioned MEMS film capacitive multi-parameter sensor is adopted in this embodiment, which includes: the carrier substrate of the MEMS device 1, the MEMS film capacitive pressure sensor 2, the MEMS film capacitive temperature sensor 3, the MEMS film capacitive Humidity sensor 4; the above-mentioned three kinds of sensors are arranged on the supporting substrate 1 in parallel.

[0034] Such as Figure 7 As shown, the MEMS film capacitive pressure sensor 2 is provided with an upper electrode 7 and a lower electrode 5. The upper and lower electrodes form a parallel plate capacitance structure; the upper and lower electrodes are formed after the sacrificial layer 19 is released. The cavity 8 of the pressure sensor 2; the cavity 8 is film-sealed by a sealing layer 13 to keep the air pressure in the cavity 8 constant;...

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Abstract

The invention discloses an MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and an integrated manufacturing method thereof. An MEMS carrying substrate is provided with MEMS film capacitive type pressure, temperature and humidity sensors which are arranged side by side. Electrodes, sacrificial layers, sensitive layers, sensitive films and protective layers of the three sensors adopt mutually matching structures and materials and therefore can be manufactured through an integrated surface micro-processing technology. The multi-parameter sensor structure and the integrated manufacturing method provided by the invention have the advantages of reducing volume of components, simplifying technical steps and being capable of decreasing cost of sensor products to a certain extent. In addition, the wholly capacitive structure adds application potential of the MEMS film capacitive type multi-parameter sensor structure in an inductive coupling based passive wireless sensing system.

Description

technical field [0001] The invention relates to a MEMS film capacitive multi-parameter sensor structure and an integrated manufacturing method thereof, belonging to the field of MEMS sensor manufacturing. Background technique [0002] With the development of Internet of Things technology, a large number of sensors are required to collect different types of data. Therefore, the production of MEMS sensors using batch micro-nano manufacturing technology plays an important role in improving the consistency of sensor performance and reducing the energy consumption of sensor systems and sensor costs. meaning. In particular, in production and life, on the one hand, people usually pay attention to multiple parameters in the measured environment at the same time (such as: pressure, temperature, humidity, chemical composition, etc.), therefore, it is necessary to use different sensors to collect sensitive parameters separately , in order to achieve process consistency, system miniatu...

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Application Information

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IPC IPC(8): G01D5/12B81B7/00B81C1/00
Inventor 秦毅恒欧文
Owner 中科芯未来微电子科技成都有限公司
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