Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rigid panel adhesion method and smearing module utilized thereby

A hard board and coating technology, applied in the directions of bonding methods, chemical instruments and methods, and devices for coating liquids on the surface, etc., can solve the problems of increasing time, cost, difficulties, etc. The effect of improving the bonding strength and simplifying the process

Inactive Publication Date: 2012-12-12
METAL INDS RES & DEV CENT
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the existing patent case not only increases the time and cost due to the operation of additional processing steps, but also cannot remove the air bubbles that may be generated by the lamination of the two boards with a simple operation method, which relatively increases the difficulty of product production Spend

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rigid panel adhesion method and smearing module utilized thereby
  • Rigid panel adhesion method and smearing module utilized thereby
  • Rigid panel adhesion method and smearing module utilized thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to make the above-mentioned and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:

[0046] The method for laminating rigid boards of the present invention is suitable for bonding between two rigid boards, such as pasting a rigid touch panel on the surface of a liquid crystal display. The present invention is not limited to this embodiment, so it will be described in detail below "Rigid board" collectively refers to all rigid boards to be pasted.

[0047] Please refer to figure 1 As shown, it is a preferred embodiment of the present invention, and the hard board bonding method includes a coating step S1 and a pressing step S2.

[0048] Please refer to Figures 2a to 2f As shown, the coating step S1 is to coat a glue 2 on the surface of a hard board 1, and the glue 2 only has a contact portion 2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
cover factoraaaaaaaaaa
cover factoraaaaaaaaaa
Login to View More

Abstract

The invention discloses a rigid panel adhesion method including a smearing step and a pressing step. The smearing step smears glue on a surface of a first rigid panel to form a glue layer. The glue layer has a single contact portion being in one-dimensional form of a dot or line. The glue layer has a coverage ratio of no less than 50% over the surface of the first rigid panel. The pressing step touches the contact portion of the glue layer with a second rigid panel, and slowly presses the first and second rigid panels together to discharge gases between the first and second rigid panels, thereby adhering the first and second rigid panels to each other and preferably the glue layer has a coverage ratio of 50% to 70% over the surface of the rigid panel. The rigid panel adhesion method can control the contact between glue and two rigid panels to prevent bubbles from forming during the adhesion process of the rigid panels, thereby improving the adhesion quality and product yield rate.

Description

technical field [0001] The invention relates to a method for laminating hard boards, in particular to a method for laminating hard boards suitable for two rigid boards. Background technique [0002] In recent years, with the improvement and development of information technology, many information products use touch panels to replace traditional input devices such as keyboards or mice to achieve convenience, lightness and humanization. [0003] Taking the touch-sensitive liquid crystal display device as an example, it is composed of a liquid crystal display, an optical film and a touch-sensitive panel. The technology of laminating the flexible optical film on the surface of the liquid crystal display has been widely known in the industry Use and don't pose a problem. However, when the liquid crystal display is attached to the touch panel, since the liquid crystal display is composed of many laminated layers and circuits, and the liquid crystal display and the touch panel are ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B05C5/02B05C11/02
CPCB32B2309/105B05C11/023B32B37/1292B32B2457/208Y10T156/10C09J5/00G02F1/1333
Inventor 陈进和
Owner METAL INDS RES & DEV CENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com