Packaging structure embedded with electronic elements and method of fabricating the same

Abstract

A packaging structure embedded with electronic elements and a method of fabricating the same are provided. A packaging structure is provided and the structure includes: a substrate, at least an electronic module, and an adhesive material. The substrate has two opposing surfaces, at least an opening penetrating the two surfaces, and two metallic frames formed on two opening ends of the at least an opening. The electronic module is disposed in the opening and has electronic elements and an encapsulant encapsulating the electronic elements. Each of the electronic elements has two opposing active surfaces exposed from the encapsulant and electrode pads formed on the two opposing active surfaces. The electrode pads are exposed from the opening. The adhesive material is filled into the opening and a gap between the electronic module and the opening, so as to secure in position the electronic modules in the opening. Compared with the prior art, the embedded electronic elements of the packaging structure according to the present invention is prevented from short circuit, and thus has increased yield rate.

Description

technical field [0001] The invention relates to a packaging structure and a manufacturing method thereof, in particular to a packaging structure embedded with electronic components and a manufacturing method thereof. Background technique [0002] With the evolution of semiconductor packaging technology, in addition to the traditional wire bonding and flip chip semiconductor packaging technologies, different packaging types have been developed for semiconductor devices, such as direct bonding An electronic component such as a semiconductor chip with an integrated circuit is embedded and electrically integrated in a package substrate. This type of package can reduce the volume of the overall package structure and improve electrical functions, and it has become a packaging trend. . [0003] see Figure 1A to Figure 1B , which is a schematic cross-sectional view of an existing packaging structure embedded with electronic components and its manufacturing method, wherein, Figur...

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Problems solved by technology

[0006] However, in the existing manufacturing method of the packaging structure embedded with electronic components, when multiple electronic components are embedded in the opening of the substrate at the same time, it is easy to make these electronic components contact each other (such as Figure 1B and Figure 1B 'shown), or it is easy for the electronic component to touch the circuit on the surface of the substrate, resulting in a short circuit and failure of the overall packaging structure. Although the position of the electronic component can be controlled by adjusting the process parameters, the improved To a limited extent, but still unable to effectively improve the overall yield

[0007] Therefore, how to propose a packaging structure with embedded electronic components and its manufacturing method, so as to avoid the problems of short circuit easily caused when the existing electronic components are embedded in the substrate, and then cause the overall product yield to decline, has become a problem at present. Issues to be solved urgently

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