Titanium aluminium nitride dielectric layer low-radiation film and preparation process thereof
An aluminum-titanium nitride medium and technology for preparation process, which are applied in the directions of layered products, chemical instruments and methods, synthetic resin layered products, etc., can solve the problems of increased production cost, complex production process, low production efficiency, etc. Low cost, simple preparation process, and improved quality
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Embodiment 1
[0037] A low-emissivity thin film of aluminum nitride dielectric layer and its preparation process, the specific steps are as follows:
[0038] (1) Substrate pretreatment
[0039] The glass substrate passes through dilute hydrochloric acid with a pH value of 5, deionized water, sodium hydroxide solution with a pH value of 9, deionized water, and alcohol in order to clean the glass substrate and remove dirt such as oil stains on the surface, and then Dry in an oven at 60°C for later use.
[0040] (2) Coating
[0041] 1) prepare
[0042] Make preparations for the coating work of the magnetron sputtering instrument.
[0043] 2) Put the substrate and target
[0044] ① Put in the target
[0045] Put the titanium metal target with a purity of 99.99%, the aluminum metal target with a purity of 99.99%, and the silver metal target with a purity of 99.99% into the radio frequency end target position in the sputtering chamber of the coating machine, which is an AC rotating three tar...
Embodiment 2
[0057] A low-emissivity thin film of an aluminum nitride dielectric layer and a preparation process thereof, the same as in Example 1, wherein:
[0058] In step (1), dilute hydrochloric acid with a pH value of 6 and sodium hydroxide solution with a pH value of 8 are then dried in an oven at 70° C. for later use.
[0059] In step (2)-2)-②, the distance between the target position and the sample is 6cm.
[0060] In step (2)-5), the reaction nitrogen flow rate is controlled at 40sccm, the titanium target power is 70W, and the aluminum target power is 120W to prepare the inner aluminum titanium nitride film, the coating time is 60min, and the film thickness is 30nm. The silver target power is 120W, and the silver film is prepared, the coating time is 20s, and the film thickness is 11nm. The conditions for preparing the inner layer of aluminum titanium nitride thin film were used to prepare the outer layer of aluminum titanium nitride thin film, the coating time was 80 min, and th...
Embodiment 3
[0062] A low-emissivity thin film of an aluminum nitride dielectric layer and a preparation process thereof, the same as in Example 1, wherein:
[0063] In step (1), dilute hydrochloric acid with a pH value of 4 and sodium hydroxide solution with a pH value of 10 are then dried in an oven at 50° C. for later use.
[0064] In step (2)-2)-②, the distance between the target position and the sample is 12cm.
[0065] In step (2)-5), the reaction nitrogen flow rate is controlled at 25 sccm, the titanium target power is 30W, and the aluminum target power is 80W to prepare the inner aluminum titanium nitride film, the coating time is 100min, and the film thickness is 25nm. The silver target power is 80W, and the silver film is prepared, the coating time is 40s, and the film thickness is 13nm. The conditions for preparing the inner layer of aluminum titanium nitride thin film were used to prepare the outer layer of aluminum titanium nitride thin film, the coating time was 120min, and ...
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