Spatial three-dimensional layout fast composite brush-plated diamond wire saw device

Abstract

The invention discloses a spatial three-dimensional layout type quickly-composite brush electroplating diamond wire saw device, which comprises at least three electroplating baths (1) and a bracket (4). The spatial three-dimensional layout type quickly-composite brush electroplating diamond wire saw device is characterized in that each electroplating bath (1) is arranged on the bracket (4) in a three-dimensional mode; the top of the bracket (4) is provided with a pay-off wire wheel (6); the bottom of the bracket (4) is provided with a take-up wire wheel (8) capable of preventing coiling wires; a silk wire between the pay-off wire wheel (6) and the take-up wire wheel (8) is provided with a wire guide wheel (3) and a tensioning wheel (10); the tensioning wheel (10) is driven by a cylinder (11); the cylinder (11) is installed on the bracket (4) or the electroplating baths (1); and a graphite felt brush (7) is rotated on the electroplating baths (1). According to the spatial three-dimensional layout type quickly-composite brush electroplating diamond wire saw device disclosed by the invention, the deficiency of big horizontal distribution land occupation of the traditional electroplating equipment is improved, the structure is flexible and variable and has a strong applicability, continuous and composite electric brush processing is realized, a plurality of brush electroplating steps can be continuously finished, a plurality of slots are arranged on the graphite felt brush to realize multi-wire composite brush electroplating processing, and the processing efficiency is effectively improved.

Description

technical field [0001] The invention relates to an electroplating brush equipment, especially an electroplating device for preparing a diamond wire saw by brushing a diamond coating on the surface of a steel wire with a small footprint, specifically a three-dimensional spatial layout type fast composite brush-plated diamond wire Saw device. Background technique [0002] At present, with the development of science and technology, the application of precious hard and brittle crystals such as silicon crystals and sapphires has become increasingly widespread. Traditional cutting methods include steel sheet cutting, band saw cutting, and internal and external circular saw cutting, etc., which have defects such as wide kerf, low material yield, poor surface shape accuracy, and deep surface damage. Large-scale precision thin section cutting of hard and brittle crystal substrates. Consolidated abrasive diamond wire saw cutting is a new processing method proposed in response to...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to design a space three-dimensional layout type rapid composite brush-plating diamond wire saw device for the existing electroplating equipment that adopts a plane layout, occupies a large area, and is difficult to centralize harmful gases. The three-dimensional and vertical distribution on the support not only effectively solves the problem of large floor area of ​​the electroplating tank, but also realizes the centralized treatment of harmful gases generated during the production process by installing an exhaust gas collection cover above the support

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