Outer-pin-free flat semiconductor package structure adopting elastic device

Abstract

The invention discloses an outer-pin-free flat semiconductor package structure adopting an elastic device. The outer-pin-free flat semiconductor package structure comprises a lead frame, a chip, a connection sheet, an elastic heat dissipation plate and colloid, wherein the colloid covers the lead frame, the chip and the elastic heat dissipation plate; and the bottom surface of a chip seat, the outer surfaces of inner pins and the top surface of the elastic heat dissipation plate are exposed from the colloid. With the adoption of the elastic heat dissipation plate, elastic semiconductor package is realized; glue is prevented from overflowing from the top of the elastic heat dissipation plate, and the chip cannot be crushed by pressure produced by die assembly of an upper die and a lower die during package; the chip is effectively protected, and the yield of the package structure is improved; the chip seat can be used as a chip carrier and a bottom heat dissipation plate; with the elastic heat dissipation plate and the chip seat at the bottom, an effect of dissipating heat from two surfaces is achieved; the heat dissipation effect of the package structure is relatively good; and the outer-pin-free flat semiconductor package structure is suitable for integration and relatively high in minimization.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a flat semiconductor packaging structure without external leads using an elastic device. Background technique [0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is: the wafer is cut into small chips after the dicing process, and then the cut chips are glued to the corresponding small island of the substrate frame, and then ultra-fine metal wires or conductive resin are used to Connect the bonding pads of the chip to the corresponding pins of the substrate to form the required circuit; then package and protect the independent chip with a plastic case. [0003] With the rapid development of microelectronics technology and the increase in the complexity of integrated circuits, semiconductor packaging structures are require...

AI Technical Summary

Problems solved by technology

In addition, the quad flat no-lead package has a shorter signal transmission path and faster signal transmission speed, but the heat sink of the quad flat no-lead package structure can only be arranged on the surface of the package structure, therefore, either no heat dissipation device is provided , or a heat sink is provided on one side. With the miniaturization and increase in complexity of the semiconductor package structure, the heat dissipation effect of the above-mentioned heat dissipation structure cannot meet the requirements of the existing semiconductor package structure.

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