Preparation method of low-melting-point copolyamide hot melt adhesive

A copolyamide and hot-melt adhesive technology, applied in adhesives, etc., can solve problems such as low melting point, difficulty in application in the clothing industry, yellowing of product color, etc., and achieve low melting point, good viscosity, and good dimensional stability.

Inactive Publication Date: 2013-01-09
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Garment hot-melt lining is an important application field of polyamide hot-melt adhesive, which requires low melting point of materials, especially for some chemical fiber fabrics, it is hoped that the melting point of hot-melt adhesive is lower than 110°C, so as not to damage the cloth; Chinese patent CN88103468A and Chinese patent CN1590433 disclose respectively Two kinds of copolyamide hot-melt adhesives with high melting point have be

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 10.4g 1,3-malonic acid, 26.4g 1,5-glutaric acid, 21.9g 1,6-hexanedioic acid, 17.4g 2,4-dimethyl-1,6-hexanedioic acid, 7.55 g1,3-propylenediamine, 20.81g 1,5-pentanediamine, 17.75g 1,6-hexanediamine, 14.69g 2,4-dimethylhexamethylenediamine, 11.9g caprolactam, 8.53g dodecylamine , 0.15g hypophosphoric acid and 7.5g water join in the polycondensation reactor, pass into the air in the nitrogen replacement still. Temperature rises to 170°C, pressure rises to 1.0MPa, heat preservation reaction for 2.0 hours; pressure continues to rise to 1.7MPa, temperature rises to 200°C, reacts for 1 hour; pressure drops to normal pressure, temperature rises to 250°C, continues to react for 0.5 hours , The copolyamide hot-melt adhesive was obtained from the discharge, the measured melting point was 105.7° C., and the number average molecular weight was 16300.

Embodiment 2

[0022] 23.6g 1,4-butanedioic acid, 19.8g 1,5-pentanedioic acid, 19g 1,6-hexanedioic acid, 20.88g 2,4-dimethyl-1,6-hexanedioic acid, 18.48g 1,4-butanediamine, 16.7g 1,5-pentanediamine, 15.83g 1,6-hexanediamine, 18.14g 2,4-dimethylhexamethylenediamine, 20.7g caprolactam, 16.8g hexadecylamine , 0.21g phosphoric acid and 17.5g water join in the polycondensation reactor, pass into the air in the nitrogen replacement still. The temperature is raised to 185°C, the pressure is raised to 1.5MPa, and the reaction is kept for 1.5 hours; the pressure continues to rise to 1.7MPa, the temperature is raised to 220°C, and the reaction is continued for 1 hour; the pressure is reduced to normal pressure, the temperature is raised to 250°C, and the reaction is continued for 1.0 hours , The copolyamide hot-melt adhesive was obtained from the discharge, the measured melting point was 112.4°C, and the number average molecular weight was 19800.

Embodiment 3

[0024] 10.4g 1,3-malonic acid, 11.8g 1,4-butanedioic acid, 29.2g 1,6-hexanedioic acid, 24.36g 2,4-dimethyl-1,6-hexanedioic acid, 7.7 g1,3-propylenediamine, 9.15g 1,4-butanediamine, 24.13g 1,6-hexanediamine, 20.97g 2,4-dimethylhexamethylenediamine, 13.62g caprolactam, 17.4g octadecylamine , 0.25g phosphoric acid and 10.2g water join in the polycondensation reactor, pass into the air in the nitrogen replacement still. The temperature is raised to 185°C, the pressure is raised to 1.2MPa, and the reaction is kept for 2.5 hours; the pressure is continued to rise to 1.8MPa, the temperature is raised to 220°C, and the reaction is 1 hour; the pressure is reduced to normal pressure, the temperature is raised to 250°C, and the reaction is continued for 1.0 Hours, the copolyamide hot-melt adhesive was obtained from the discharge, the measured melting point was 107.5° C., and the number average molecular weight was 17,600.

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Abstract

The invention discloses a preparation method of low-melting-point copolyamide hot melt adhesive. The preparation method includes that aliphatic dicarboxylic acid with 3-8 carbon number, aliphatic diamine with 3-8 carbon number, caprolactam, water and catalyst are added in a reaction kettle, simultaneously high-boiling-point monoamine is added to serve as a molecular weight regulator, the temperature rises to 170-250 DEG C under the protection of nitrogen, and finally the copolyamide hot melt adhesive is obtained through condensation reaction. The melting point of the obtained hot melt adhesive is below 115 DEG C and is particularly suitable for adhesion of heat-sensitive fiber fabric or leather fabric.

Description

technical field [0001] The invention relates to a preparation method of a low melting point copolyamide hot melt adhesive. technical background [0002] Polyamide hot-melt adhesive is a kind of hot-melt adhesive prepared by melt polycondensation of aliphatic dibasic acid and diamine. [0003] From the perspective of molecular structure, copolyamide has strong intermolecular force and interface electrostatic attraction, and has good affinity and strong adhesion to various materials; at the same time, copolyamide hot melt adhesive also has fast curing speed, Environmentally friendly and pollution-free, stable physical and chemical properties, insoluble in water, easy to transport and use, etc., so it is widely used in the bonding of fabrics, metals, plastics, leather and other materials. Garment hot-melt lining is an important application field of polyamide hot-melt adhesive, which requires low melting point of materials, especially for some chemical fiber fabrics, it is hope...

Claims

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Application Information

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IPC IPC(8): C08G69/36C09J177/02C09J177/06
Inventor 曾作祥骆楚华李哲龙朱万育韩涛马志艳
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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