Standard of highly-integrated, multi-functional and high-capacity-storage X86 single-board computer module

Abstract

The invention discloses a standard of a highly-integrated, multi-functional and high-capacity-storage X86 single-board computer module. Various embedded computer application systems can be built in cooperation with client carrier boards with arbitrary shapes and sizes. In the module, a high-capacity memory, a miniature solid hard disk, two circuits of 100Mbps Ethernet interfaces and an LVDS (low voltage differential signaling) display interface are adhered to the surface of a printed circuit board with a size of just 90x70 mm. Two 100Pin small double-row surface-mounted hole-pattern combination hubs are arranged on one side of the module; a first double-row surface-mounted hole-pattern combination hub is connected with an ISA (industry standard architecture) bus signal; and a second double-row surface-mounted hole-pattern combination hub is connected with a commonly used peripheral interface of a PC (personal computer) machine. According to the invention, through the connection of the two 100Pin high-density hole-pattern combination hub and the client carrier boards without cable connection, the embedded computer application systems are simpler in development, agiler in expansion, easier in upgrading and more economic in manufacturing cost, and can meet various embedded applications.

Description

technical field [0001] The invention relates to an embedded computer module, in particular to a highly integrated, multi-functional, large-capacity storage X86 single-board computer module standard. Background technique [0002] Commonly embedded computer application systems are constructed using some standard embedded computer modules, such as PC / 104 and ETX module standards. The PC / 104 bus module standard has good mechanical properties and is suitable for applications in rugged applications, but its bus connectors and interface connectors are large in size, low in pin density, and the positions of the connectors are scattered and not fixed, which makes the size of the board relatively large (90×96mm), the device density is low, the integration level is not high, there are many cable connections between the PC / 104 module and the customer carrier board, the cables need to be replaced when the system is upgraded, the system upgrade is difficult and uneconomical, and it is lim...

AI Technical Summary

Problems solved by technology

The PC / 104 bus module standard has good mechanical properties and is suitable for applications in rugged applications, but its bus connectors and interface connectors are large in size, low in pin density, and the positions of the connectors are scattered and not fixed, which makes the size of the board relatively large (90×96mm), the device density is low, the integration level is not high, there are many cable connections between the PC / 104 module and the customer carrier board, the cables need to be replaced when the system is upgraded, the system upgrade is difficult and uneconomical, and it is limited in small application of space

The ETX module is connected to the customer's carrier board through four 100Pin high-density connectors, and can be replaced like a chip in the application system. The cable connection between them, but its size is relatively large (114×95mm), and its mechanical characteristics are not as good as PC / 104 bus connectors. Some special reinforcement measures need to be taken in applications with high vibration and shock to limit its use in Rugged applications in tight spaces

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