Hermetic packaging assembly and packaging method
A technology of hermetic packaging and components, applied in the direction of electrical components, measuring devices, electrical solid devices, etc., can solve the problems of increasing equipment costs, reducing production efficiency, occupying effective volume, etc., to reduce costs, improve production efficiency, and increase space The effect of utilization
Active Publication Date: 2016-02-03
항저우다리마이크로일렉트로닉컴퍼니리미티드
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Problems solved by technology
The use of complex fixtures will increase equipment costs, occupy the effective volume of the vacuum furnace, reduce production efficiency, etc., which is not conducive to further reducing the manufacturing cost of MEMS sensors
Method used
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no. 1 Embodiment approach
[0032] attached figure 2 Shown is a schematic diagram of the implementation steps of the method described in this specific embodiment, including: step S20, placing a solder ball with a diameter greater than the sum of the thickness of the first and second solder rings at the opening of the hole, and the eutectic temperature of the solder ball less than the eutectic temperature of the first welding ring and the second welding ring; step S21, fasten the upper plate and the lower plate, and the first welding ring and the second welding ring are aligned with each other, because the diameter of the solder ball is larger than that of the first and second welding rings The sum of the thicknesses of the two welding rings, so there is a distance between the first welding ring and the second welding ring; step S22, adjust the ambient air pressure and composition to a predetermined value; step S23, increase the temperature to be greater than the eutectic of the solder ball temperature, ...
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The invention provides a hermetic sealing assembly and a sealing method. The hermetic sealing assembly comprises an upper plate and a lower plate, wherein a second welding ring is arranged on the lower surface of the upper plate, the shape of the second welding ring is the same as that of a first sealing ring, and at least one hole is further arranged on the upper surface of the lower plate and used for placing a solder ball with the diameter larger than the thickness sum of the first welding ring and the second welding ring on the opening portion. The hermetic sealing assembly has the advantages that by adopting the solder ball with the diameter larger than the height sum of the upper welding ring and the lower welding ring to perform pre-supporting and firstly melting the solder ball during reflow soldering to achieve airtightness, a complex clamp is avoided. By means of the technical scheme, a plurality of devices can be sealed together simultaneously, a plurality packaging casings can be firmly distributed, accordingly space utilization rate of a furnace body is improved, production efficiency can be improved, and cost can be reduced.
Description
technical field [0001] The invention relates to semiconductor packaging, in particular to an airtight packaging assembly and a packaging method. Background technique [0002] The purpose and function of packaging technology is to protect the chips of microelectronic products and avoid damage to the chips from adverse factors in the external environment such as mechanical damage, water vapor, oxygen, and corrosive ions. At the same time, the package provides the electrical connection and mechanical support between the chip and the outside world. The packaging technology of semiconductor chips ranges from metal packaging, ceramic packaging, plastic packaging, to the current chip size packaging (CSP), wafer level packaging (WLP), 3D packaging, etc. Factors driving its development include cost reduction and volume reduction Wait. [0003] The packaging of MEMS sensors is more complex than that of semiconductor circuits. First of all, in addition to the protection and electric...
Claims
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IPC IPC(8): B81B7/00B81C3/00
Inventor 姜利军
Owner 항저우다리마이크로일렉트로닉컴퍼니리미티드