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Normal-temperature chemical tinning solution

A tin plating solution and chemical technology, applied in the field of electroplating chemistry, can solve the problems of large consumption, high operating temperature and harsh working environment.

Inactive Publication Date: 2014-09-24
NANJING DADI REFRIGERATION FOOD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, electroless tin plating usually deposits a chemical tin layer on the surface of nickel, copper or copper alloy through a mixed solution of hydrochloric acid and tin protochloride at a high temperature of about 90°C. This process has high operating temperature and harsh working environment, and due to The rapid volatilization of hydrochloric acid makes the plating solution poor in stability and consumes a lot

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0006] The present invention will be further described below in conjunction with the accompanying drawings.

[0007] Add 70% measured pure water into the plating tank, then add 20g / L of sodium hydroxide, after completely dissolving, add 12g / L of tetrahydroxypropyl ethylenediamine, 8g / L of HEDP (hydroxyl ethylidene diphosphonic acid), 5g / L of sodium citrate, 10ppm of 2,2-bipyridine, 1g / L of Tween 80 and 1g / L of polyethylene glycol 3000, stirred and dissolved, and finally added the remaining amount of pure water.

[0008] After the workpiece of copper metal, copper-tin alloy or nickel metal is activated by dilute sulfuric acid and washed with water, it is immersed in the above chemical tin plating solution at 25°C, and deposited for 10-30s to obtain a dull silver-white metallic tin coating.

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Abstract

The invention discloses a normal-temperature chemical tinning solution which comprises the following components: 5-10 g / L stannous chloride, 15-30 g / L sodium hydroxide, 10-15 g / L tetrahydroxypropyl ethylenediamine, 5-10 g / L HEDP (hydroxyethylidenediphosphonic acid), 5-10 g / L sodium citrate, 5-15 ppm 2,2-dipyridine, 0.5-2 g / L Tween-80, 1-2 g / L polyethyleneglycol 3000 and the balance of pure water. The invention can deposit lusterless silver-white chemical tinned layer on the surface of metal, such as copper, copper-tin alloy, nickel or the like, under normal temperature conditions.

Description

technical field [0001] The invention belongs to the technical field of electroplating chemistry, in particular to electroless tin plating. Background technique [0002] At present, electroless tin plating usually deposits a chemical tin layer on the surface of nickel, copper or copper alloy through a mixed solution of hydrochloric acid and tin protochloride at a high temperature of about 90°C. This process has high operating temperature and harsh working environment, and due to The rapid volatilization of hydrochloric acid makes the plating solution poor in stability and consumes a lot. Contents of the invention [0003] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a normal temperature chemical tin plating solution, which can deposit chemical tin coating at normal temperature. [0004] Technical solution: In order to solve the above-mentioned technical problems, the present invention adopts the following ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/52C25D3/30C25D3/32
Inventor 陈大弟
Owner NANJING DADI REFRIGERATION FOOD