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A Wafer Bonding Wax

A bonding and chip technology, applied in the direction of wax adhesive, rosin adhesive, etc., can solve the problems of insufficient adhesive force and insufficient tensile shear strength

Active Publication Date: 2016-08-10
江苏泰尔新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the bonding wax of disclosed technology at present, after testing, tensile shear strength is generally at 12-22Kg / cm 2 , so sometimes good and sometimes bad in the actual wafer processing process, the fundamental reason is that the adhesion force is not enough, that is, the tensile shear strength is not high enough

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The wafer bonding wax of the present invention comprises the following components in weight percentage: 5% of microcrystalline wax, 10% of synthetic wax, 10% of amide wax, 65% of rosin and 10% of modified rosin.

[0032] The softening point of the wafer bonding wax is 89°C, and the kinematic viscosity at 110°C is 156mm 2 / s, the tensile shear strength is 42Kg / cm 2 .

Embodiment 2

[0034] The wafer bonding wax of the present invention comprises the following components in weight percentage: 5% of microcrystalline wax, 10% of synthetic wax, 5% of amide wax, 70% of rosin and 10% of modified rosin.

[0035] The softening point of the wafer bonding wax is 84°C, and the kinematic viscosity at 110°C is 137mm 2 / s, the tensile shear strength is 32Kg / cm 2 .

Embodiment 3

[0037] The wafer bonding wax of the present invention comprises the following components in weight percentage: 5% of microcrystalline wax, 5% of synthetic wax, 10% of amide wax, 75% of rosin and 5% of modified rosin.

[0038] The softening point of the wafer bonding wax is 87°C, and the kinematic viscosity at 110°C is 185mm 2 / s, the tensile shear strength is 39Kg / cm 2 .

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Abstract

The invention aims to disclose a wafer adhesive wax, comprising the following components of, by weight, 1-5% of a microcrystalline wax, 5-10 % of a synthetic wax, 5-10% of a amide wax, 65-75% of rosin and 5-10% of a modified rosin. Compared with a conventional wafer adhesive wax, the wafer adhesive wax provided by the invention has a moderate softening point, good viscosity and fluidity and high cohesive force. The softening point is 80-90 DEG C; kinematic viscosity is 100-200 mm<2> / s at a temperature of 110 DEG C; and the tensile shear strength is higher than 30 Kg / cm<2>. The wafer adhesive wax can realize the object of the invention.

Description

technical field [0001] The present invention relates to a bonding wax, in particular to a chip bonding wax with high tensile shear strength. Background technique [0002] In the polishing process of various wafers, the more commonly used polishing methods are wax-free polishing and wax polishing. With the continuous increase of single crystal diameter, wax polishing has gradually become the main polishing method for large diameter wafers. At the same time, for thinner wafers, since wax polishing is to completely fix the wafer on the substrate, it is not easy to break during the polishing process, so it has also become the main polishing method for thinner wafers. The above-mentioned "wax" is actually a wax-containing adhesive material. In fact, in the process of wafer processing, the cutting and polishing processes require high-strength bonding and fixing of the wafer. Currently, the mainstream adhesive materials are rosin and paraffin wax. Prepared. [0003] For example,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J193/04C09J191/06
Inventor 王玫刘家芳李毅宋丽萍章安龙
Owner 江苏泰尔新材料股份有限公司
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