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Low-melting-point lead-free solder alloy

A lead-free solder alloy, low melting point technology, applied in the field of solder, low melting point lead-free solder alloy, can solve the problems of increased cost, less bismuth, unable to meet the temperature requirements, etc., to refine the alloy structure, improve gloss, improve The effect of brazing properties and impact resistance

Active Publication Date: 2014-09-10
上海一远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The content of bismuth in this solder alloy is small and the content of indium is relatively high. Although the addition of bismuth can improve the strength of the solder, it cannot meet the ideal temperature requirements.
At the same time, the amount of In added as a precious metal is too much, which greatly increases the cost of production

Method used

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  • Low-melting-point lead-free solder alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A low melting point lead-free solder alloy, the lead-free solder alloy contains the weight percent of the following components:

[0027] Bi: 10%; Ag: 2.8%; In: 0.5%; P: 0.005%; the balance is Sn, and unavoidable impurities may also be included.

[0028] The low melting point lead-free solder alloy in this embodiment is prepared by the following method:

[0029] Weigh the required raw materials according to the weight percentages of Bi, Ag, In, P and Sn in this example, add them to the furnace, and then heat up to 300°C to melt, then put them into a mixer and stir them for 40 minutes before casting Forming to obtain the low melting point lead-free solder alloy of the present invention.

Embodiment 2

[0031] A low melting point lead-free solder alloy, the lead-free solder alloy contains the weight percent of the following components:

[0032] Bi: 15%; Ag: 2.8%; In: 0.5%; P: 0.0052%; the balance is Sn, and unavoidable impurities may also be included.

[0033] The preparation method of the low-melting-point lead-free solder in this embodiment is the same as the method described in Embodiment 1, the only difference is that the weight percentages of the components of the lead-free solder alloy are weighed according to the proportions in this embodiment.

Embodiment 3

[0035] A low melting point lead-free solder alloy, the lead-free solder alloy contains the weight percent of the following components:

[0036] Bi: 20%; Ag: 2.5%; In: 0.8%; P: 0.0055%; the balance is Sn, and unavoidable impurities may also be included.

[0037] The preparation method of the low-melting-point lead-free solder in this embodiment is the same as the method described in Embodiment 1, the only difference is that the weight percentages of the components of the lead-free solder alloy are weighed according to the proportions in this embodiment.

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Abstract

The invention relates to a low-melting-point lead-free solder alloy which belongs to the technical field of welding materials and is used for solving the problem that the conventional solder alloys are high in melting point and low in shearing strength. The low-melting-point lead-free solder alloy comprises the following components in percentage by weight: 10-30% of Bi, 2.2-3.0% of Ag, 0.5-1.0% of In, 0.004-0.008% of P and the balance being tin. The low-melting-point lead-free solder alloy also can comprise 0.002-0.005% of RE and 0.002-0.005% of Co. According to the low-melting-point lead-free solder alloy, the melting point is low, the alloy eutectic temperature is about 170-200 DEG C, the shearing strength is good and between 21-28N / mm<2>, the RE is capable of improving the glossliness of the solder alloy and refining the grains, the Co is capable of improving the soldering performance and the shock resistance, and Zr has the function of homogenizing and refining the alloy tissues.

Description

technical field [0001] The invention relates to a solder, in particular to a lead-free solder alloy with a low melting point, belonging to the technical field of soldering materials. Background technique [0002] For a long time, Sn-Pb alloy has been used as the main packaging material in the electronics industry, and has dominated the assembly of electronic components. However, because lead and its lead compounds are highly toxic substances, they are extremely toxic to the human body. Especially in recent years, with the enhancement of people's awareness of environmental protection and concern for their own health, lead pollution has been paid more and more attention by people; and in recent years, the ban on lead proposed by various countries has made the electronic packaging industry put forward higher requirements for lead-free soldering. Requirements, the mature tin-lead solder must be replaced by lead-free solder. [0003] Currently, the lead-free solders recognized b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C13/02
Inventor 余洪桂黄玲霞吴芝锭刘婷
Owner 上海一远电子科技有限公司
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