Method for preparing circuits on flexible base materials and application thereof

A technology of flexible substrates and circuits, applied in printed circuits, printed circuit manufacturing, electrical components, etc., to achieve the effects of no environmental pollution, improved efficiency, and reliable methods

Inactive Publication Date: 2013-03-06
JINSHAN DEZHI MEDICAL APPLIANCE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] There are many deficiencies in terms of technology and cost when the technology of t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The method for preparing a circuit on a flexible substrate described in this embodiment includes the following steps:

[0038] (1) preparing a graphic structure with a certain thickness on the surface of the first substrate by photolithography technology, printing etching technology or laser etching technology, and becoming a circuit template;

[0039] (2) Depositing the conductive material in the form of a film on the surface of the circuit template to form a conductive film;

[0040] (3) printing or coating the adhesive on the surface of the conductive film or the surface of the second substrate;

[0041] (4) spreading the first substrate onto the second substrate;

[0042] (5) Pressurizing and / or heating between the two substrates by transfer printing to make the adhesive play a role;

[0043] (6) After the time is determined, the two substrates are separated to form the required circuit pattern on the surface of the second substrate.

[0044] In step (1), the fir...

Embodiment 2

[0048] This embodiment provides a method for preparing an RFID tag antenna by using a method of preparing a circuit on a flexible substrate, and preparing a graphic material with a specific height according to the graphic design of the RFID tag antenna. Coating the polyimide photoresist material on the metal aluminum foil on the surface of the first substrate; or laminating the polyimide photoresist film on the metal aluminum foil on the first substrate surface. The first substrate may be a polyimide film coated with epoxy resin glue, the epoxy resin glue has firm adhesion to the first substrate and the metal foil, and the photoresist material has firm adhesion to the metal foil. Expose and develop the photoresist material according to the pattern of the RFID tag antenna to form a specific pattern. After that, the etching process in the FPC manufacturing process is used to etch away the metal foil in the part not protected by the photoresist material, and the remaining part be...

Embodiment 3

[0051] This embodiment provides a method for preparing a circuit on a flexible substrate for the preparation of a conductive circuit for electrodes of a rapid detection test paper based on electrochemical principles, such as a blood glucose test paper. The electrodes of this kind of test paper are generally made of inert conductive materials, such as carbon, gold, platinum, palladium, etc. Commercially, conductive carbon paste is generally used to prepare electrodes. However, the conductivity of carbon paste is not good, and it is necessary to add conductive lines on the carbon electrode, usually by printing conductive silver paste. The method of the present invention utilizes the conductive properties of materials such as cheap aluminum and copper, and the low-cost method for preparing circuits on flexible substrates to prepare conductive circuits, which helps to solve the cost problem of electrode raw materials.

[0052] The preparation method of the conductive circuit is t...

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Abstract

The invention discloses a method for preparing circuits on flexible base materials, comprising the following steps of (1) preparing a graphic structure with a certain thickness on the surface of a first base material to form a circuit template; (2) depositing a conducting material on the surface of the circuit template in the form of a film to form a conducting film; (3) printing or coating an adhesive on the surface of the conducting film or the surface of a second base material; (4) spreading out the first base material on the second base material; (5) pressing and/or heating between the two base materials by adopting a transfer print method to exert the function of enable the adhesive; and (6) separating the two base materials after confirming the time so as to form the circuit graphic needed to be prepared on the surface of the second base material. According to the method, the preparation of the circuit is realized by utilizing the thickness of the circuit template, the adhesiveness of the adhesive and the appropriate adhesive force of the conducting material on the circuit template, and therefore, the processes are reduced, the cost is lowered, the efficiency is improved, and people do not need to worry about environmental pollution.

Description

technical field [0001] The invention relates to a method and application for preparing a circuit, in particular to a method and application for preparing a circuit on a flexible substrate. Background technique [0002] The circuit structure made on the flexible base material has the characteristics of small volume, light weight and bendability. Applications for such circuits include touch screens, Radio Frequency Identification (RFID) tag antennas, membrane switches, keypads, FLEXIBLE PRINTED CIRCUIT (FPC), and biological or medical sensors. Manufacturing methods include printing methods, such as screen printing or flexographic printing; etching or electroplating methods can also be used. There are also related reports on the method of transfer printing. [0003] For example, in the preparation technology of RFID tag antenna, etching / stamping antenna technology is generally adopted in the world, and its material is generally aluminum or copper. However, its preparation co...

Claims

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Application Information

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IPC IPC(8): H05K3/20
Inventor 宗小林
Owner JINSHAN DEZHI MEDICAL APPLIANCE TECH
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