Monocrystal silicon wafer polishing process capable of obtaining high polishing rate

Abstract

The invention relates to a monocrystal silicon wafer polishing process capable of obtaining a high polishing rate. In a coarse polishing process, an American Dupont SR330 coarse polishing solution is adopted, and diluted by pure water according to the ratio of 1:20 to 1:40; the flow is 23.5-24.5 L / min; a Rohm and Haas SUBA600 polishing pad is adopted; and the coarse polishing process comprises the following three steps: 1, using a coarse polishing solution to polish for 10 s, the rotating speed of a big disk being 23-27 rpm, the rotating speed of a central guide wheel being 48-52 rpm, and the pressure being 47-53 kPa; 2, using a coarse polishing solution to polish for 7-13 min, the rotating speed of the big disk being 38-42 rpm, the rotating speed of the central guide wheel being 78-82 rpm, and the pressure being 100-200 kPa; and 3, using pure water to polish for 40 s, the rotating speed of the big disk being 23+ / -27 rpm, the rotating speed of the central guide wheel being 48-52 rpm, and the pressure being 47-53 kPa. The polished section processed by the process has the removal rate up to 1.83-2.09 micron / min, which is far higher than the average level of 1 micron / min in the industry, and meanwhile, and has the pass percent up to more than 90% stably. The improvement of the productivity of the polished section can reduce the fixed cost, thereby meeting the requirements of domestic and foreign markets.

Description

technical field [0001] The invention relates to a wax polishing technology for a semiconductor single crystal silicon wafer polishing sheet, in particular to a single crystal silicon wafer polishing process capable of obtaining a high polishing rate. Background technique [0002] With the take-off of China's economy and the development of domestic IC industry, there is a strong demand for polished monocrystalline silicon wafers, which are substrate materials for semiconductor devices. Polishing capacity is a key indicator for the production of single crystal silicon wafer polished wafers. Increasing polishing capacity can dilute fixed costs, reduce production costs, and help meet the growing market demand. [0003] Compared with wax-free polishing, wax polishing has become the mainstream technology of international polishing sheet manufacturers because of its advantages in polishing surface flatness. This type of polishing machine generally has a faster patch action than po...

AI Technical Summary

Problems solved by technology

Rough polishing is mainly used to remove the damaged layer produced by the previous process, and its removal rate is the largest; the removal rate of medium polishing and fine polishing is much lower than that of rough polishing, while medium polishing and fine polishing are mainly used to repair the stress damage of rough polishing, remove The rate cannot be too high, so there is not much room for improvement in the removal rate of medium polishing and fine polishing