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Packaging resin composition

A technology of encapsulating resin and composition, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of increased loss rate, reduced efficiency, deviation, etc., and achieve the effect of reducing increased loss rate, reduced efficiency, and reduced color temperature difference

Inactive Publication Date: 2013-03-13
SWANCOR ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The titration method cannot accurately control the shape of the phosphor powder coating, which greatly affects the optical color quality of the LED. It is often found that the color temperature distribution in the space is uneven, such as the yellow halo phenomenon, and due to the relationship between the phosphor powder precipitation, it causes light emission. Diode color temperature (Color Temperature, referred to as CT) deviation
The chip is packaged by using the light-emitting diode packaging colloid mixed with phosphor powder. During the packaging process, the phosphor powder is prone to serious precipitation of phosphor powder due to the action of gravity, and the distribution of phosphor powder in the light-emitting diode packaging colloid is uneven.
If it will also lead to uneven color temperature and the formation of obvious yellow halo or blue halo phenomenon
Moreover, when the power of the chip is high, if the phosphor deposits and comes into direct contact with the chip, it is easy to cause problems such as reduced efficiency and increased loss rate due to poor heat dissipation, thereby increasing the failure rate of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0022] Experimental example 1---The polymer resin is epoxy resin

[0023] According to the composition and dosage shown in Table 1, the polymer resin, hardener and filler were uniformly mixed and stirred for 25 minutes, and then phosphor powder was added and stirred continuously for 12 minutes to obtain Examples 1 to 93 (Ex.1 ~Ex.93) and the compositions of Comparative Examples 1 to 12 (C.Ex.1~C.Ex.12), after that, put the obtained compositions into conical plastic tubes to observe the precipitation of phosphor powder, and put The observed results are shown in Table III. Among them, glycidyl ether-based epoxy resin and alicyclic epoxy resin were used as polymer resin in Experimental Example 1, and acid anhydride was used as hardener.

experiment example 2

[0024] Experimental example 2---The polymer resin is silicone resin

[0025] According to the same method as Experimental Example 1, Examples 94 to 129 (Ex.94~Ex.129) and Comparative Examples 13 to 22 (C.Ex.13~C.Ex) were obtained according to the composition and dosage shown in Table 2. .22), and then put the obtained compositions into conical plastic tubes to observe the precipitation of phosphor powder, and the observation results are shown in Table 4. Wherein, the polymer resin in Experimental Example 2 uses a vinyl-containing silicone resin, and the curing agent uses a silicone-hydrogen-containing silicone resin.

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Abstract

A packaging resin composition comprises polymer resin containing an epoxy group or an unsaturated double bond, a hardener enabling the polymer resin to crosslink and solidify, a filler and a phosphor, wherein the a mass ratio of the polymer resin and the hardener is 8.0-92.0 w % : 8.0-92.0 w % in components consisting of the polymer resin and the hardener; an amount of the filler is 0.05-10.0 wt % of the total amount of the polymer resin and the hardener, and an amount of the phosphor is 1-40.0 wt % of the total amount of the polymer resin and the hardener. The packaging resin composition provided by the invention enables the phosphor in packaging colloid of light emitting diodes to uniformly distribute, and thus can effectively reduce difference in color temperature of the light emitting diodes; furthermore, the uniformly distributed phosphor is not easy to directly contact with a chip, and thus problems of reduced efficiency and increased loss rate caused by poor heat radiation of the phosphor can be reduced, and yield of the product can be improved.

Description

technical field [0001] The invention relates to an encapsulation resin composition, in particular to an encapsulation resin composition which can effectively reduce the color temperature difference of light-emitting diodes. Background technique [0002] At present, the mainstream manufacturing method of light-emitting diode (LED for short) is phosphor conversion technology, which uses a blue light-emitting diode chip to emit blue light to excite the phosphor powder coated on the top, and convert part of the blue light into yellow light. And then mixed with the blue light of the blue light-emitting diode to form white light; in a remote (Remote) chip coated phosphor packaging process, the blue light emitted by a blue light diode chip is used to excite the coating on a colloid (the material is selected from epoxy resin) and one of the silica gel) above the phosphor, converts part of the blue light into yellow light, and then mixes with the blue light of the blue light-emitting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/07C08L83/05C08G59/42C08K3/36C08K3/22H01L33/56
Inventor 黄伟翔陈信宏
Owner SWANCOR ADVANCED MATERIALS CO LTD
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