Limit mold for back lapping of infrared focal plane detector and preparation method

Abstract

The invention discloses a limit mold for back lapping of an infrared focal plane detector and a preparation method. Uniformity and homogeneity of thicknesses of detector chips can be accurately controlled due to the special limit design of the limit mold, the limit mold is mainly made of two diamond pieces with very large hardness, the back lapping and polishing condition of the detector chips almost has no effect on the diamond pieces, rectangular holes are opened at the centers of the two diamond pieces through a laser according to the feature size of the detector and the mold is divided into two portions along the diagonals of the rectangular holes through Disco cutting, and special DW3 low-temperature gum is used for bonding and curing the two layers. According to the limit mold, raw materials are simple and easy to obtain, accurate thickness control is provided, the technological process is controllable, the operation processes are few, and the mold can be recycled and has wide applicability.

Description

technical field [0001] The invention relates to the field of infrared focal plane detector manufacturing, in particular to a device preparation process for an infrared focal plane detector, specifically a limiting mold and a preparation method used in the device back thinning process. Background technique [0002] The infrared focal plane detector is composed of a chip (infrared photosensitive element), a readout circuit and a gemstone substrate flip-welded interconnection. The back thinning of the focal plane detector is to obtain the chip thickness and optical surface that match the optical system within the deviation range, reduce the internal stress on the photosensitive element of the chip, improve the low-temperature reliability of the device, and also improve the back-illuminated type. Backside transmission of HgCdTe infrared focal plane detectors. Therefore, the back thinning process of the focal plane detector is a key basic process technology that affects device p...

AI Technical Summary

Problems solved by technology

[0004] There are many shortcomings in the above method: first, the consistency and uniformity of the chip thickness of each focal plane module cannot be guaranteed; Accumulate multiple layers of accompanying sheets. After each layer of accompanying sheets is pasted and fixed, it is easy to cause the interlayer movement of the accompanying sheets when the wax is melted again, making the operation complicated and uncontrollable; finally, the preparatory work of the early stage and the cleaning of the middle and lower layers of the accompanying sheets Large volume, low work efficiency

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