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Method and device for eliminating nanoparticles on surfaces of substrates under assistance of laser

A nanoparticle and laser-assisted technology, which is applied in the direction of cleaning methods and appliances, laser welding equipment, chemical instruments and methods, etc., can solve the problems of easily damaged substrates and difficult removal of particles, so as to avoid pollution and damage, avoid damage, avoid Effects of matrix damage and contamination

Inactive Publication Date: 2013-03-27
JIANGSU UNIV
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Problems solved by technology

[0004] Aiming at the problems of easily damaged and polluted substrates and difficult removal of particles with a size of 100nm and smaller in conventional nanoparticle removal methods, the present invention proposes a method and device for laser-assisted removal of nanoparticles on the surface of substrates

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  • Method and device for eliminating nanoparticles on surfaces of substrates under assistance of laser
  • Method and device for eliminating nanoparticles on surfaces of substrates under assistance of laser
  • Method and device for eliminating nanoparticles on surfaces of substrates under assistance of laser

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Embodiment

[0033] The following is an example of laser-assisted removal of nanoparticles on the surface of a substrate. Thales lasers are used to remove ceria particles (60 nm in diameter) from the surface of a silicon wafer. The vertical distance from the upper surface of the silicon wafer to the focal point of the convex lens is 1.5 mm. , wavelength 1064 nm, repetition frequency 10 Hz, pulse width 5 ns) focusing to form plasma expansion to remove nanoparticles on the surface of the silicon wafer substrate; figure 2 (a) is the surface of the silicon wafer with cerium oxide particles (60 nm in diameter) attached to it before laser cleaning, and (b) is the surface of the silicon wafer after laser cleaning. The dotted line in the figure is the dividing line between the non-laser cleaning area and the laser cleaning area; From the figure, we can see that after the laser radiation, the cerium oxide particles (60 nm in diameter) on the surface of the silicon wafer are effectively removed, and...

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Abstract

The invention relates to a method and device for eliminating nanoparticles on the surfaces of substrates, such as a silicon wafer under the assistance of laser and in particular relates to a method and device which are characterized in that air is subjected to dielectric breakdown by using laser focusing to form sharply inflated plasmas, the air around the plasmas is rapidly compressed into a stronger shock front, and the stronger shock front directly acts on the surface of the substrate so that the nanoparticles are separated from the substrate, such as a wafer or a photomask under the action of force or rolling torque. The method and device disclosed by the invention are particularly suitable for removing 100nm and even smaller particles on the surface of the substrate.

Description

technical field [0001] The invention relates to a method and device for laser-assisted removal of nanoparticles on the surface of silicon wafers and other substrates, in particular to a method and device for laser-assisted dielectric breakdown of air to form rapidly expanding plasma, and the air around the plasma is rapidly compressed into a stronger plasma. The shock wave front directly acts on the surface of the substrate to separate the nanoparticle from the substrate such as wafer or photomask under the action of force or rolling moment. The method and device are especially suitable for removing 100 nm and smaller size particles particle. Background technique [0002] The removal of nanoparticles on the surface of the substrate is a key issue in high-tech industries such as micromachines, precision optics, microelectronics, and semiconductors. Nanoparticles will cause fatal damage such as scratches or even cracks on the surface of micromachines, greatly reducing the reso...

Claims

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Application Information

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IPC IPC(8): B08B7/00B23K26/36
Inventor 鲁金忠罗开玉钟金杉罗密齐晗刘娟王志龙
Owner JIANGSU UNIV
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