Cyanide-free alkaline bright copper plating solution and preparation method and electroplating process thereof

Abstract

The invention provides a cyanide-free alkaline bright copper plating solution and a preparation method and an electroplating process thereof and belongs to the field of electroplating. The cyanide-free alkaline bright copper plating solution comprises copper salt, main alkali, copper salt complexant and brightener, wherein the copper salt complexant comprises a main complexant and an auxiliary complexant, and the brightener is one or several of nicotinic acid, indole acitic acid, poly-diaminoarea and ethyoxyl-2-alkyne alcohol ether. The corresponding preparation method adopts a step-by-step mixed dissolving method, the electroplating process comprises pretreatment, electroplating and aftertreatment, wherein the electroplating adopts the cyanide-free alkaline bright copper plating solution as the plating solution. The cyanide-free alkaline bright copper plating solution is stable, not apt to get muddy and strong in impurity resisting capability, the plated copper layer is good in binding force with a base body, and the performance of the plating solution and the performance of the plated layer both can reach the effect obtained by adopting cyanide for copper plating.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a cyanide-free alkaline bright copper plating solution, a preparation method thereof and an electroplating process. Background technique [0002] The electroplated copper layer has good ductility, electrical conductivity, thermal conductivity, easy to polish, and has strong affinity and good binding force with iron and other metals. Therefore, the copper plating layer can be used as the bottom layer of pre-plating or multi-layer electroplating, saving a lot of nickel and Other precious metals are widely used in machinery, electronics, aerospace, weapons, automobiles, ships and other industrial fields. Since the current cyanide-free copper plating technology is not yet mature, there are problems such as poor bonding with iron substrates and other metal coatings, narrow current density range, low current efficiency, and non-bright coatings. Therefore, there are still a large number o...

AI Technical Summary

Problems solved by technology

These alkaline copper plating processes have problems such as unstable plating solution, easy turbidity, weak resistance to impurities, easy replacement and precipitation of copper on the steel substrate, resulting in poor bonding between the copper plating layer and the substrate.

The most obvious is that the performance of the bath and the performance of the coating cannot reach the effect obtained by using cyanide copper plating

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