Light-emitting diode (LED) packaging structure of dispensing coating long-distance type fluorescent powder and manufacture method

Abstract

The invention discloses a light-emitting diode (LED) packaging structure of dispensing coating long-distance type fluorescent powder and a manufacture method thereof. The LED packaging structure of dispensing coating long-distance type fluorescent powder and the manufacture method aim at solving the puzzle that the fluorescent powder layer in the prior art is uneven in thickness and the dispensing technology cannot be applied to manufacture of the long-distance type fluorescent powder. A silica gel layer special in structure is designed, the external profile of the silica gel layer is of a convex structure having an outward extending platform, an LED chip is packaged inside, the bottom surface is connected with a substrate, and a fluorescent powder layer is coated on the upper surface. The fluorescent powder layer in the LED packaging structure is isolated from the chip, and the fluorescent powder layer is even in thickness and regular in shape and can cover the light-emitting area of the lateral surface of the chip. The fluorescent powder layer can be manufactured without a die and the production cost can be reduced compared with the traditional long-distance type fluorescent powder coating LED packaging technology.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to the glue dispensing technology of fluorescent powder, in particular to an LED packaging structure and a preparation method for remote coating of fluorescent powder. Background technique [0002] LED (Light Emitting Diode), a light-emitting diode, is a solid-state semiconductor device that can directly convert electrical energy into light energy. It changes the principle of incandescent lamp tungsten filament luminescence and energy-saving lamp three-based toner luminescence, and uses electric field luminescence. The characteristics of LED are very obvious, such as long life, high luminous efficiency, low radiation and low power consumption. The spectrum of white LEDs is almost entirely concentrated in the visible light band, and its luminous efficiency can exceed 150lm / W. [0003] LED packaging refers to the packaging of light-emitting chips, which is quite different from...

AI Technical Summary

Problems solved by technology

[0005] The phosphor powder is directly coated on the periphery of the chip, which means that the light emitted from the chip touches the phosphor powder. This light output mode has two disadvantages: 1. Part of the light is directly reflected back to the chip by the phosphor powder, and this part of the light disturbs the light emitted by the chip.

2. The heat generated by the chip is directly transmitted to the phosphor layer, which accelerates the temperature rise of the phosphor, directly damages and reduces the life of the phosphor, and causes LED lamp reliability problems

[0007] The existing long-distance phosphor layer coating technology is far from mature, and the unsolved problems are: 1. Phosphor layer with uniform thickness and regular shape; 2. Phosphor layer covering the light-emitting area on the side of the chip; 3. No mold Preparation of Phosphor Layer

The technical solutions that solve the above three problems at the same time often require extremely high precision and complex processes

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