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High temperature resistant semi-aromatic polyamide, preparation method and applications thereof

A semi-aromatic and polyamide technology, applied in the field of high-temperature-resistant semi-aromatic polyamide, can solve the problem of high cost, achieve the effect of improving flexibility, improving toughness and adhesion, and simple preparation method

Active Publication Date: 2013-04-03
SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of polyimide adhesives is relatively high in the industrial production process, and most of them are in the research stage.

Method used

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  • High temperature resistant semi-aromatic polyamide, preparation method and applications thereof
  • High temperature resistant semi-aromatic polyamide, preparation method and applications thereof
  • High temperature resistant semi-aromatic polyamide, preparation method and applications thereof

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preparation example Construction

[0046] The preparation process of the semi-aromatic polyamide in the present invention can be divided into two steps. First, the nylon salt is prepared into a semi-aromatic nylon primary polymer under specific conditions, and then the primary polymer is dissolved in an organic solvent in the application process. , and then cured by heating to obtain a cured semi-aromatic polyamide adhesive.

[0047] The nylon salt formed by isophthalic acid and aliphatic diamine and the nylon salt formed by terephthalic acid and aliphatic diamine used in this example are disclosed on the first page to the second page in the description of Chinese patent CN 1887841A prepared by the method.

[0048] The concrete preparation process of nylon salt is as follows:

[0049] Add isophthalic acid or terephthalic acid into the dissolution tank, then add water 2-5 times the weight of the acid, and heat to 60-105°C while stirring to obtain an acid solution for use, and at the same time, dissolve the alip...

Embodiment 1

[0056] Raw material formula:

[0057] 40 wt% of decyl diamine isophthalate (10I salt)

[0058] 45wt% decylenediamine terephthalate (10T salt)

[0059] 15wt% melamine

[0060] According to the above proportions, weigh the raw materials of each component and add them to the polymerization kettle containing water (the amount of water is 50% of the total weight of the above components), vacuumize, feed nitrogen until the pressure in the kettle reaches 2.0MPa, and heat up to 200° C. and react for 3 hours to prepare a semi-aromatic polyamide with an intrinsic viscosity of 0.1 dl / g.

[0061] The semi-aromatic polyamide prepared above was dissolved in N,N'-dimethylformamide to obtain a semi-aromatic polyamide adhesive solution with a concentration of 78 wt%. Use this adhesive to bond the aluminum alloy. Before bonding, the surface of the aluminum alloy is polished and polished with iron sandpaper to remove impurities. Then apply the semi-aromatic polyamide adhesive solution on bot...

Embodiment 2

[0066] Raw material formula:

[0067] 20wt% nonanediamine isophthalate (9I salt)

[0068] 70wt% nonanediamine terephthalate (9T salt)

[0069] 6wt% pyromellitine

[0070] 4wt% melamine

[0071] According to the above proportioning ratio, the raw materials of each component are weighed and added to a polymerization tank containing water (the amount of water is 100% of the total weight of the above components). Vacuumize, feed nitrogen until the pressure in the kettle reaches 1.8MPa, raise the temperature to 200°C, and react for 4 hours to obtain a semi-aromatic polyamide with an intrinsic viscosity of 0.12dl / g.

[0072] The semi-aromatic polyamide prepared above was dissolved in N,N'-dimethylformamide to obtain a semi-aromatic polyamide adhesive solution with a concentration of 68 wt%. Use this adhesive to bond the aluminum alloy. Before bonding, the surface of the aluminum alloy is polished and polished with iron sandpaper to remove impurities. Then, the upper semi-aromat...

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Abstract

The invention belongs to the technical field of polymer materials, and discloses a high temperature resistant semi-aromatic polyamide, a preparation method and applications thereof. The high temperature resistant semi-aromatic polyamide is prepared from the following components, by weight, 20-60 wt% of a nylon salt formed from m-phthalic acid and aliphatic diamine, 30-70 wt% of a nylon salt formed from p-phthalic acid and aliphatic diamine, and 1-15 wt% of a multi-functional group active monomer substance. The preparation method comprises the following steps: adding 20-60 wt% of a nylon salt formed from m-phthalic acid and aliphatic diamine, 30-70 wt% of a nylon salt formed from p-phthalic acid and aliphatic diamine, 1-15 wt% of a multi-functional group active monomer substance, and water to a polymerization kettle, wherein a use amount of the water is 20-200 wt% of the total weight of the three raw materials; vacuumizing and introducing nitrogen; and carrying out heating condensation polymerization to prepare the semi-aromatic polyamide. The present invention further discloses a method for adopting the high temperature resistant semi-aromatic polyamide as an adhesive to adhere a metal. The product of the present invention has good curing stability.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and relates to a high-temperature-resistant semi-aromatic polyamide, a preparation method and an application thereof. Background technique [0002] With the rapid development of high technology, people have higher and higher requirements for materials, especially for the application of non-metallic materials. Therefore, the connection between structural parts or non-structural parts has become a limit to the application of many materials with excellent performance. the bottleneck. As an important material that can be used for material connection, adhesive can partially replace traditional welding, riveting or bolting, and can even be used in parts that cannot be connected by welding or riveting at all. [0003] In the continuous progress and development of adhesives, the requirements for the working temperature of heat-resistant adhesives are getting higher and higher. The products oft...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/26C08G69/28C09J177/06C09J5/02
Inventor 祝孟俊张怀忠杨桂生
Owner SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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