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Preparation method and metamaterial of a dielectric substrate

A dielectric substrate and metamaterial technology, applied in the field of metamaterials, can solve problems such as difficulty in finding materials, materials that cannot meet requirements, and dielectric constants that cannot be achieved, and achieve low dielectric constants, accurate and flexible design approaches Effect

Active Publication Date: 2016-07-06
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing artificial microstructures of metamaterials are generally metal materials, and the dielectric substrate generally adopts organic resin substrates. The dielectric constant of organic resin substrate materials is generally between 3 and 5. For some applications of metamaterials, often A material with a lower dielectric constant is required as a dielectric substrate, and it is difficult to find a suitable material while satisfying various mechanical properties
Even if there is a material with a lower dielectric constant and meets the mechanical performance requirements, its dielectric constant is determined by the nature of the material itself and cannot reach the predetermined value required by the metamaterial.
[0005] In addition, with the continuous expansion of the application field of metamaterials, the requirements for metamaterial dielectric substrates are getting higher and higher, such as insulation, light weight, non-toxic, flame retardant, cheap, etc., the existing dielectric substrate materials can not meet the requirements

Method used

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Embodiment 1

[0029] At first prepare porous silicon dioxide airgel powder, can adopt following method: take ethyl orthosilicate as silicon source, get ethyl orthosilicate, water and ethanol mix homogeneously, mol ratio is equivalent to ethyl orthosilicate: Water: ethanol ratio 1: 3.5: 4-20, add dilute hydrochloric acid with a concentration of 0.35mol / L dropwise, adjust the pH value to 2.5-3.5, let stand in a constant temperature water bath at 60°C for 120 minutes, add ammonia water to adjust the pH value to 4 About until the gel is obtained, aging at room temperature for one day, aging the obtained wet silica gel in absolute ethanol for 30 days, and finally using carbon dioxide as the drying medium to perform supercritical drying to obtain blocky porous silica airgel , to obtain porous silica airgel powder after crushing and grinding;

[0030] The porous silica airgel powder is added to the epoxy resin glue, the porous silica airgel powder is 30% of the mass fraction of the epoxy resin glu...

Embodiment 2

[0035] At first prepare porous silica airgel powder, can adopt following method: Methyl orthosilicate: water: ethanol: HCl presses 1: 3.5: 8: 8.4 * 10 -4 The molar ratio was mixed to obtain a mixed solution, kept at 60°C for 2 hours in a constant temperature water bath, dripped with ammonia water with a mass fraction of 1.5%, adjusted the pH value to 2.5-3.5, and carried out supercritical carbon dioxide drying. Heat treatment at a temperature of ℃ to obtain massive porous silica airgel, and obtain porous silica airgel powder after crushing and grinding;

[0036] Add the porous silica airgel powder to the brominated epoxy resin glue, the porous silica airgel powder is 80% of the mass fraction of the brominated epoxy resin glue, and the brominated epoxy resin glue The solution is prepared from the following ingredients, using acetone as a solvent, adding diaminodiphenylmethane as a curing agent, adding brominated epoxy resin, stirring and dissolving, and obtaining brominated epo...

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Abstract

The invention provides a preparation method of a dielectric substrate and a metamaterial. The metamaterial comprises the dielectric substrate and a plurality of artificial microstructures which are arranged on the dielectric substrate, the dielectric substrate is an organic resin substrate, and porous silica aerogel powder is uniformly distributed in the organic resin substrate. The preparation method of the dielectric substrate and the metamaterial have the following beneficial effects: the porous silica aerogel powder is added into a material of a metamaterial dielectric substrate, so that the dielectric constant of the metamaterial dielectric substrate reaches up to an extremely low range from 1 to 2, and the dielectric constant of the metamaterial dielectric substrate is further controlled by controlling the addition of the porous silica aerogel powder, so that a more accurate and flexible designing way is provided for the application of the metamaterial; and in addition, the metamaterial prepared by the preparation method of the metamaterial dielectric substrate provided by the invention has the advantages of lightness, non-toxicity, flame retardance and cheapness.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to the preparation technology of metamaterial dielectric substrate materials. 【Background technique】 [0002] Metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, the limitation of some apparent natural laws can be broken through, so as to obtain the supernormal material function beyond the ordinary nature inherent in nature. The properties and functions of metamaterials mainly come from their internal structures rather than the materials that make them up, so a lot of research work has been done to design and synthesize metamaterials. In 2000, Smith et al. of the University of California pointed out that the composite structure of periodically arranged metal wires and split-ring resonators (SRR...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/14C08K7/26C08K7/14C08K7/04C08K7/06C08J5/04H01Q15/00
Inventor 刘若鹏赵治亚金曦李雪缪锡根
Owner KUANG CHI INST OF ADVANCED TECH