Preparation method and metamaterial of a dielectric substrate
A dielectric substrate and metamaterial technology, applied in the field of metamaterials, can solve problems such as difficulty in finding materials, materials that cannot meet requirements, and dielectric constants that cannot be achieved, and achieve low dielectric constants, accurate and flexible design approaches Effect
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Embodiment 1
[0029] At first prepare porous silicon dioxide airgel powder, can adopt following method: take ethyl orthosilicate as silicon source, get ethyl orthosilicate, water and ethanol mix homogeneously, mol ratio is equivalent to ethyl orthosilicate: Water: ethanol ratio 1: 3.5: 4-20, add dilute hydrochloric acid with a concentration of 0.35mol / L dropwise, adjust the pH value to 2.5-3.5, let stand in a constant temperature water bath at 60°C for 120 minutes, add ammonia water to adjust the pH value to 4 About until the gel is obtained, aging at room temperature for one day, aging the obtained wet silica gel in absolute ethanol for 30 days, and finally using carbon dioxide as the drying medium to perform supercritical drying to obtain blocky porous silica airgel , to obtain porous silica airgel powder after crushing and grinding;
[0030] The porous silica airgel powder is added to the epoxy resin glue, the porous silica airgel powder is 30% of the mass fraction of the epoxy resin glu...
Embodiment 2
[0035] At first prepare porous silica airgel powder, can adopt following method: Methyl orthosilicate: water: ethanol: HCl presses 1: 3.5: 8: 8.4 * 10 -4 The molar ratio was mixed to obtain a mixed solution, kept at 60°C for 2 hours in a constant temperature water bath, dripped with ammonia water with a mass fraction of 1.5%, adjusted the pH value to 2.5-3.5, and carried out supercritical carbon dioxide drying. Heat treatment at a temperature of ℃ to obtain massive porous silica airgel, and obtain porous silica airgel powder after crushing and grinding;
[0036] Add the porous silica airgel powder to the brominated epoxy resin glue, the porous silica airgel powder is 80% of the mass fraction of the brominated epoxy resin glue, and the brominated epoxy resin glue The solution is prepared from the following ingredients, using acetone as a solvent, adding diaminodiphenylmethane as a curing agent, adding brominated epoxy resin, stirring and dissolving, and obtaining brominated epo...
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