Manufacturing method of MLCOB (Multi Lens Chips On Board) light source module

Abstract

The invention relates to a manufacturing method of an MLCOB (Multi Lens Chips On Board) light source module. The method comprises the steps of: (1) preparing a substrate; (2) curing crystal and welding lines in a welding pad area on the substrate; (3) placing the substrate in a dispensing clamp and placing in an oven for pre-heating treatment; (4), after pre-heating treatment of the substrate, rapidly placing the substrate on a pre-heating area on a heating platform of a dispensing table; then, slowing conveying the substrate to a dispensing area of the heating platform of the dispensing table through a conveyer belt, wherein the dispensing clamp which is thermally stable is heated in the pre-heating area; (5) in the dispensing process, temperature in the dispensing area of the heating platform is constant within 130-250 DEG C, and delivery of the dispensing head is uniform; (6) quickly curing glue within 0-5 seconds after dispensing and forming a lens; and (7) conveying the substrate from a plate delivery area of the heating platform of the dispensing machine to the oven to roast and cure. The lens is directly moulded through dispensing, so that the manufacturing process is simple and the cost is low.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a manufacturing method of MLCOB LED light source modules, in particular to a manufacturing method of MLCOB LED light source modules used in fluorescent lamps, panel lights, table lamps and other application products. Background technique [0002] In recent years, the application of LED light sources in the field of lighting has attracted much attention. Traditional incandescent lamps consume a lot of power, and the electromagnetic interference and electromagnetic pollution caused by fluorescent lamps are relatively serious, while the stability and safety of high-pressure gas discharge lamps are poor. In contrast, LEDs used as lighting sources have super energy-saving, With absolute advantages such as environmental protection, low voltage, easy control, not easy to damage, and no ultraviolet rays, it will become a new generation of light sources that replace traditional light sources such as i...

AI Technical Summary

Problems solved by technology

The disadvantage is that defects are prone to occur during the substrate processing process, and the embedded circuit layer process is complex, and the circuit connection between the chip and the chip is likely to cause poor soldering and affect product performance.

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