Hot-press heads and hot-press device

Abstract

The invention discloses a hot-press device. The hot-press device comprises a hot-press head pair, a hot-press head pressure control system and a hot-press head temperature control system, wherein the hot-press head pair comprises an upper hot-press head and a lower hot-press head; the hot-press head pressure control system is connected with a power assembly of the lower hot-press head by an air pipe and is used for providing gas with stable pressure to the power assembly by closed loop feedback pressure control, and heating assemblies are driven to do reciprocating linear movement by the power assembly under the action of the pressure gas; and the hot-press head temperature control system is electrically connected with a first heating assembly of the upper hot-press head and a second heating assembly of the lower hot-press head, and is used for stabilizing the temperatures of the heating assemblies by closed loop feedback temperature control. According to the hot-press device, the power assemblies of the hot-press heads are connected into a control air path in parallel, and the same air pressure is provided by the pressure control system, so that the pressure output from a plurality of hot-press heads can be consistent. The temperatures of the multiple hot-press heads are stabilized by the closed loop feedback temperature control, so that the problems of an existing hot-press head that the pressure is inconvenient to adjust, and the stability and the consistency of the pressure and the temperature are difficult to ensure can be solved.

Description

technical field [0001] The invention relates to the technical field of RFID label hot-press curing, in particular to a hot-press head and a hot-press device. Background technique [0002] The Flip Chip packaging process commonly used in the production of radio frequency identification (RFID) tags includes dispensing, mounting, hot pressing, and testing. ; 2. The placement head picks up the RFID chip and places it on the pad of the antenna substrate; 3. Use the thermal head to make the conductive adhesive solidify under the simultaneous action of pressure and heat; 4. Check whether the finished label meets the requirements for use. [0003] Conductive adhesive is composed of organic polymer matrix and conductive filler (conductive particles) uniformly dispersed in it. It is a type of adhesive with adhesive and conductive properties. It is mainly divided into isotropic conductive adhesive (ICA), Anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA). Based o...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to address the deficiencies in the prior art, to provide a pneumatic hot pressing device, which solves the problems of inconvenient pressure adjustment of the existing hot pressing head, difficulty in ensuring the stability and consistency of pressure and temperature, and can realize hot pressing Automatic adjustment of head pressure to improve actual production efficiency and yield

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