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Surface treatment method and application of heat-conducting packing

A thermally conductive filler and surface treatment technology, applied in fibrous fillers, dyed organosilicon compound treatments, etc., can solve the problems of high hardness, insufficient thermal conductivity, and inability to achieve softness of thermally conductive silicone sheets, and achieve low hardness, Conducive to environmental protection and the effect of reducing emissions

Active Publication Date: 2013-05-08
东莞智炜新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, there are two prominent problems in the domestic production of thermal silica gel sheets: either the thermal conductivity is not high enough, especially in terms of thermal insulation materials; or the hardness of thermal silica gel sheets is too high, which cannot reach the softness of foreign products.
Dry treatment is generally to directly mix the treatment agent with the inorganic filler, and then mix it with the organic vehicle, or even directly mix the treatment agent, the inorganic filler and the organic vehicle. This treatment method is relatively simple, but the treatment effect is relatively poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1: the surface treatment method of the thermally conductive filler provided by this embodiment, it comprises the following steps:

[0031] (1) Weighing silane coupling agent, organic solvent and distilled water respectively in proportion, wherein said organic solvent is 95% ethanol, absolute ethanol or isopropanol;

[0032] (2) Add the organic solvent and distilled water weighed in step (1) into the silane coupling agent in turn, stir and mix evenly, then drop into the acid solution, adjust the pH value of the mixed solution to 3.5-5.5, and then Let it stand for 5-30 minutes under certain conditions, and set aside;

[0033] (3) Weighing the thermally conductive filler, heating the mixed solution prepared in step (2) to 50-80° C., and maintaining the temperature, adding the thermally conductive filler into the mixed solution, stirring under reflux for 2 to 6 hours, and filtering out the thermally conductive filler;

[0034] (4) Put the heat-conducting filler ...

Embodiment 2

[0044] Embodiment 2: This embodiment provides a surface treatment method and application of a thermally conductive filler. The method steps are basically the same as those in Embodiment 1, except that:

[0045] The surface treatment method of thermally conductive filler, it may further comprise the steps:

[0046] (1) Weigh 2 g of 16-alkyl trimethoxysiloxane, 196 g of 95% ethanol, and 2 g of distilled water;

[0047] (2) Add the 95% ethanol and distilled water weighed in step (1) into 16 alkyltrimethoxysiloxane successively, after stirring and mixing evenly, drop into dilute glacial acetic acid solution, and adjust the pH value of the mixed solution to 5.5, then stand at 25°C for 20 minutes, and set aside;

[0048](3) Weigh 200g of alumina with a median particle size of 45 microns and 5 microns, mix them in a mass ratio of 6:4, heat the mixed solution prepared in step (2) to 60°C, and keep the temperature, add the alumina mixture Into the mixed solution, after reflux and sti...

Embodiment 3

[0051] Embodiment 3: The surface treatment method and application of the thermally conductive filler provided in this embodiment, the method steps are basically the same as those in Embodiment 1 and 2, the difference is that:

[0052] The surface treatment method of thermally conductive filler, it may further comprise the steps:

[0053] (1) Weigh KH7924g, absolute ethanol 146g, distilled water 10g;

[0054] (2) Add the anhydrous ethanol and distilled water weighed in step (1) into KH792 in turn, stir and mix evenly, then drop in dilute glacial acetic acid solution, adjust the pH value of the mixed solution to 4.8, and Let stand for 10 minutes, set aside;

[0055] (3) Weigh 200 g of aluminum nitride, heat the mixed solution prepared in step (2) to 50° C., and keep the temperature, add aluminum nitride to the mixed solution, stir under reflux for 6 hours, and filter out the aluminum nitride;

[0056] (4) Put the aluminum nitride filtered out in step (3) into an oven, and bake...

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Abstract

The invention discloses a surface treatment method of heat-conducting packing. The surface treatment method is characterized by comprising the following steps of (1) respectively weighing an organic silane coupling agent, an organic solvent and distilled water; (2) orderly adding the organic solvent and the distilled water to the silane coupling agent, dripping acid solution after evenly stirring and mixing; adjusting the pH value of the mixed solution to 3.5-5.5; and then stewing for 5-30 minutes under the condition of 25 DEG C for use; (3) weighing the heat-conducting packing, heating the prepared mixed solution to 50-80 DEG C and keeping the temperature; adding the heat-conducting packing to the mixed solution to reflux and stir for 2-6 hours, and then filtering out the heat-conducting packing; and (4) putting the filtered heat-conducting packing into an oven to bake for 2-6 hours under the condition of 80-120 DEG C, so as to obtain the heat-conducting packing after surface treatment. Application of a heat-conducting silica gel sheet prepared from the heat-conducting packing is also disclosed by the invention; and the silica gel sheet is excellent in heat-conducting property, and good in overall performance.

Description

technical field [0001] The invention relates to the field of thermally conductive materials, in particular to a surface treatment method for thermally conductive fillers and its application for preparing thermally conductive silica gel sheets with excellent performance. Background technique [0002] At present, there are two prominent problems in the domestic production of thermal silica gel sheets: either the thermal conductivity is not high enough, especially in terms of thermal insulation materials; or the hardness of thermal silica gel sheets is too high, which cannot reach the softness of foreign products. . The main aspect that affects these two issues is the amount of thermally conductive filler added, but these two issues are another contradiction. To increase the thermal conductivity, it is necessary to add more thermally conductive fillers. As a result, the thermal conductivity is increased, but the hardness of the thermally conductive sheet is increased, and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C3/12C09C1/62C09C1/00C09C1/04C09C1/40C09C1/28C08L83/07C08K9/06C08K3/08C08K3/22C08K3/28C08K3/38C08K3/34
Inventor 张安洪刘燕锋
Owner 东莞智炜新材料股份有限公司
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