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Microtube fabrication process

A manufacturing process and a technology for micro-tubes, which are applied in photolithography process exposure devices, patterned surface photolithography processes, and manufacturing microstructure devices, etc., can solve the problem of increased manufacturing costs, high processing costs, and unimproved efficiency. and other problems, to achieve the effect of avoiding projection lithography equipment and electron beam exposure equipment

Inactive Publication Date: 2013-05-08
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the higher the precision of lithography equipment, the higher the processing cost
When the diameter of the microtube is very small, especially when it is close to the submicron scale, ordinary contact exposure equipment can not meet the required precision requirements, so it is necessary to use projection exposure equipment or electron beam with higher precision and more expensive Exposure equipment, the cost of the equipment is greatly increased, the efficiency is not improved, and the manufacturing cost is also greatly increased

Method used

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  • Microtube fabrication process
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Experimental program
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Effect test

Embodiment 1

[0035] The technical solution of this embodiment can be specifically implemented through the following steps:

[0036] Step 1, photolithography

[0037] Spin-coat photoresist AZ5214 on a clean substrate with a thickness of 3 μm; use a mask with a circular array pattern, the circular area is opaque, and the diameter of the circle is 31 m; use a MA6 contact photolithography machine for exposure.

[0038] Step 2, developing

[0039] The substrate exposed in the first step is put into AZ300 developer solution for development, and a photoresist microtube array structure is obtained on the substrate. The developed structure is as figure 2 shown.

[0040] Step 3, etch

[0041] Etching the substrate with the photoresist microtube array structure after development in step 2, for example, using ICP etching, the etching depth is preferably 12 μm, to obtain a silicon microtube array with a height of 12 μm and an external diameter of 3 μm, Such as image 3 shown.

Embodiment 2

[0043] The technical solution of this embodiment can be specifically implemented through the following steps:

[0044] Step 1, photolithography

[0045] Spin-coat AZ5214 photoresist on a clean substrate with a thickness of 12 μm; use a mask with a circular array pattern, the circular area is opaque, and the diameter of the circle is 30 μm; use a MA6 contact photolithography machine for exposure.

[0046] Step 2, developing

[0047] The substrate exposed in the first step is put into RD6 developing solution for development, and the microtube array structure of photoresist is obtained on the substrate.

[0048] Step 3, etch

[0049] Etching the substrate with the photoresist microtube array structure after development in step 2, for example, by ICP etching, the etching depth is preferably 10 μm, to obtain a silicon microtube array with a height of 10 μm and an external diameter of 30 μm, Such as image 3 shown.

[0050] The photoresists in the above embodiments of the prese...

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Abstract

The invention discloses a microtube fabrication process. The microtube fabrication process comprises the following steps of: spin-coating a photoresist on a substrate, and exposing the substrate by use of a round mask, which has the diameter equal to the outer diameter of the microtube to be processed; developing the exposed substrate in a developing solution to obtain the microtube structure with photoresist on the substrate; and etching the developed substrate having the microtube structure with photoresist to obtain a microtube array on the substrate. The invention also discloses a microtube fabricated by the method. In the photoetching process, a light enhancement region and a dark area are formed due to reflection of the substrate as well as diffraction of the round mask, and the microtube can be formed by etching the substrate. Accordingly, a microtube with high precision can be fabricated by using an etching apparatus with certain precision, thereby solving the problem that a photoetching apparatus with corresponding precision is necessary for the microtube fabrication.

Description

technical field [0001] The invention belongs to a micro-nano manufacturing process, in particular to a manufacturing process of a micron tube array, which is applicable to the fields of solar cells, hydrophobic materials, micro heat exchangers and the like. Background technique [0002] Micro-nanowires and micro-nanotube arrays are the most common structures in the field of micro-nano manufacturing. Since this periodic structure is relatively easy to manufacture and has some excellent properties, such as greatly increasing the surface area and superhydrophobicity, it can be applied to materials and devices such as solar cells, hydrophobic materials, photonic crystals, and nanolasers. middle. [0003] The commonly used processing methods for micro-nanowires and micro-nanotube arrays are growth and etching. The growth method is generally to coat a catalyst film or deposit catalyst particles on the substrate, and then grow in the atmosphere or liquid. This method is generall...

Claims

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Application Information

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IPC IPC(8): G03F7/00G03F7/20B81C1/00B81B1/00
Inventor 廖广兰谭先华史铁林高阳
Owner HUAZHONG UNIV OF SCI & TECH