Encapsulating method of advanced square flat pins-free and encapsulating structure thereof

Abstract

The invention relates to an encapsulating method of an advanced square flat pins-free and an encapsulating structure of the advanced square flat pins-free. The encapsulating method includes the following steps: a wafer, a chip and a leading wire frame are provided. The leading wire frame is half etched. Pins arranged in a normality distribution mode are formed on the front side of the wafer. The thickness of the wafer is reduced to the preset thickness and the wafer is scrapped into pieces. The chip is placed in an island area of the leading wire frame. The chip is solidified, the leading wire frame with the chip placed is cleaned and the leading wire is bonded. The advanced square flat pins-free is plastic packaged by a plastic packaging machine in a plastic mode. An uncut dambar is formed through a half etching step between the pins and the pins in the leading wire frame and the uncut dambars are etched in a wet mode, thus the uncut dambars are disconnected and the pins are separated. The pins are cleaned and the pins are electroplated after that the pins are cleaned. The advanced square flat pins-free is labeled on the surface of a plastic package body. The leading wire frame is incised, thus a single body encapsulation product is formed. By means of the encapsulating method of advanced square flat pins-free and the encapsulating structure of the advanced square flat pins-free, an input / output (I / O) connecting way is improved, an I / O port in an unit encapsulating surface area is effectively improved, thus the integratable degree in the same encapsulating surface area is improved.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an advanced square flat non-lead packaging method and its packaging structure. Background technique [0002] The development of today's electronic consumer products is changing with each passing day, showing that the functional integration is getting higher and higher, and the volume is getting smaller and smaller, especially the thickness of electronic products is shrinking. The market share exceeds that of ordinary mobile phones, especially Apple's iphone4 and Android-based smart phones. [0003] The existing traditional QFN package (QFN, short for Quad Flat No-lead, square flat no lead) uses a copper alloy frame for penetrating etching, and partially uses half-etching, and then performs chip loading, wire bonding, plastic packaging, A series of process steps such as cutting can only achieve two rows of staggered pins at most, resulting in a small number of input and outpu...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing traditional QFN packaging method, such as the small number of I / O per unit area, low integration, and large packaging volume.

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