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Mirror plates used for circuit board lamination process voltage machine lamination

A pressing process and circuit board technology, which is applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problem of increasing the production cost of circuit boards (pcb), which can only be pressed about 60 to 100 times, and increase the production cost of circuit boards and other issues, to achieve the effect of reducing the consumption of aluminum resources, improving product quality, and reducing overall costs

Active Publication Date: 2015-09-16
SUZHOU JIAMING MACHINERY MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing circuit board (pcb) voltage machine pressing process requires a lot of pressure (400PSI / cm 2 ), so there are mainly the following two problems: 1. For circuit boards with 6 layers or more than 6 layers, pre-riveting is required before lamination (generally 4-8 points on one board), the difference between the riveting points The flatness will cause the mirror plate to deform and sag under the influence of high pressure during the pressing process
The deformation and depression of the mirror plate will affect the quality of the circuit board (pcb) in the subsequent recycling process, resulting in a large amount of scrap costs. However, the hardness of the mirror plate made of existing aluminum materials is generally only HV100, which is Generally, the service life of the battery can only be pressed about 60~100 times (very low), which will greatly increase the production cost of circuit board (pcb) manufacturing
2. The raw material of the existing mirror plate is aluminum, and the thermal volume expansion coefficient of the aluminum material is: 23.0×10 -6 ~23.5×10 -6 1 / K (relatively large), when heated, under the action of pressure, the circuit board (pcb) will deform with the volume expansion of the mirror plate, the faster the heating rate, the greater the deformation of the circuit board (pcb) , so that the circuit board (pcb) will be scrapped to a certain extent, which will also greatly increase the production cost of circuit board (pcb) manufacturing

Method used

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  • Mirror plates used for circuit board lamination process voltage machine lamination
  • Mirror plates used for circuit board lamination process voltage machine lamination
  • Mirror plates used for circuit board lamination process voltage machine lamination

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Embodiment Construction

[0020] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0021] see figure 1 , the embodiment of the present invention includes:

[0022] A mirror plate 100 for circuit board lamination process voltage machine lamination, consisting of three layers, including an intermediate layer 10 and surface insulating layers 21, 22 compounded on the upper and lower surfaces of the intermediate layer 10, the intermediate layer The layer 10 is steel plate, stainless steel plate or titanium plate, the hardness range of the middle layer 10 is HV170~HV700, the thickness range of the middle layer 10 is 0.4-10mm; the surface insulating layers 21, 22 are aluminum oxide Or metal oxides such as ceramics or zirconia, the ha...

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Abstract

The invention discloses a pressing runner plate of an electric press for pressing processing of printed circuit boards. The pressing runner plate comprises an intermediate layer, an upper insulating layer and a lower insulating layer, wherein the intermediate layer is sandwiched between the upper insulating layer and the lower insulating layer and is a metal plate with hardness ranging from HV170 to HV700, the hardness of the upper insulating layer and the lower insulating layer ranges from HV300 to HV2000, and surface roughness of the same ranges from Ra0.05 to Ra2.1. The service life of the pressing runner plate can be prolonged, manufacture quality of the printed circuit boards can be improved, and accordingly, manufacture cost of the printed circuit boards is reduced.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a mirror plate used for circuit board lamination process voltage machine lamination. Background technique [0002] The existing circuit board (pcb) voltage machine pressing process requires a lot of pressure (400PSI / cm 2 ), so there are mainly the following two problems: 1. For circuit boards with 6 layers or more than 6 layers, pre-riveting is required before lamination (generally 4-8 points on one board), the difference between the riveting points The flatness will cause the mirror plate to deform and sag under the influence of high pressure during the pressing process. The deformation and depression of the mirror plate will affect the quality of the circuit board (pcb) in the subsequent recycling process, resulting in a large amount of scrap costs. However, the hardness of the mirror plate made of existing aluminum materials is generally only HV100, which is Generally...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00B32B15/04
Inventor 沈金明
Owner SUZHOU JIAMING MACHINERY MFG
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