Mirror plates used for circuit board lamination process voltage machine lamination

Abstract

The invention discloses a pressing runner plate of an electric press for pressing processing of printed circuit boards. The pressing runner plate comprises an intermediate layer, an upper insulating layer and a lower insulating layer, wherein the intermediate layer is sandwiched between the upper insulating layer and the lower insulating layer and is a metal plate with hardness ranging from HV170 to HV700, the hardness of the upper insulating layer and the lower insulating layer ranges from HV300 to HV2000, and surface roughness of the same ranges from Ra0.05 to Ra2.1. The service life of the pressing runner plate can be prolonged, manufacture quality of the printed circuit boards can be improved, and accordingly, manufacture cost of the printed circuit boards is reduced.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a mirror plate used for circuit board lamination process voltage machine lamination. Background technique [0002] The existing circuit board (pcb) voltage machine pressing process requires a lot of pressure (400PSI / cm 2 ), so there are mainly the following two problems: 1. For circuit boards with 6 layers or more than 6 layers, pre-riveting is required before lamination (generally 4-8 points on one board), the difference between the riveting points The flatness will cause the mirror plate to deform and sag under the influence of high pressure during the pressing process. The deformation and depression of the mirror plate will affect the quality of the circuit board (pcb) in the subsequent recycling process, resulting in a large amount of scrap costs. However, the hardness of the mirror plate made of existing aluminum materials is generally only HV100, which is Generally...

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Problems solved by technology

[0002] The existing circuit board (pcb) voltage machine pressing process requires a lot of pressure (400PSI / cm 2 ), so there are mainly the following two problems: 1. For circuit boards with 6 layers or more than 6 layers, pre-riveting is required before lamination (generally 4-8 points on one board), the difference between the riveting points The flatness will cause the mirror plate to deform and sag under the influence of high pressure during the pressing process

The deformation and depression of the mirror plate will affect the quality of the circuit board (pcb) in the subsequent recycling process, resulting in a large amount of scrap costs. However, the hardness of the mirror plate made of existing aluminum materials is generally only HV100, which is Generally, the service life of the battery can only be pressed about 60~100 times (very low), which will greatly increase the production cost of circuit board (pcb) manufacturing

2. The raw material of the existing mirror plate is aluminum, and the thermal volume expansion coefficient of the aluminum material is: 23.0×10 -6 ~23.5×10 -6 1 / K (relatively large), when heated, under the action of pressure, the circuit board (pcb) will deform with the volume expansion of the mirror plate, the faster the heating rate, the greater the deformation of the circuit board (pcb) , so that the circuit board (pcb) will be scrapped to a certain extent, which will also greatly increase the production cost of circuit board (pcb) manufacturing

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