Material heat conduction analysis device based on fluorescence method

An analysis device and fluorescence method technology, applied in the field of thermal property analysis of materials, can solve problems such as being susceptible to electromagnetic interference and unable to be widely used in industrial measurement fields, and achieve good anti-electromagnetic interference ability, good measurement accuracy, and simple measurement principle Effect
CN103134833AActive Publication Date: 2013-06-05南京五石金传感技术有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
南京五石金传感技术有限公司
Publication Date
2013-06-05

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Abstract

The invention relates to a material heat conduction analysis device based on a fluorescence method, and belongs to the field of material thermal property analysis. The material heat conduction analysis device comprises a probe (1), a photoelectric module and a data processing module. The probe (1) is used for detecting fluorescence sensing materials (7) on an object to be tested and transmitting detected optical signals to the photoelectric module through optical fibers (2). The photoelectric module coverts the received optical signals into electric signals, and converts the electric signals into temperature signals and then transmits the temperature signals to the data processing module. The data processing module obtains a temperature change curve according to the temperature signals, obtains a thermal diffusion coefficient of the detected object through comparison with standard data, and transmits the thermal diffusion coefficient to an upper computer for heat conduction analysis. The material heat conduction analysis device can be applied to measurement of thermal diffusion coefficients of gas, liquid and solid, is simple in structure, high in flexibility, and has the advantages of being better in measurement accuracy and anti-electromagnetic interference capacity, and achieving functions of miniaturization, intellectualization and online monitoring.
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Description

technical field

[0001] The invention relates to a material heat conduction analysis device based on a fluorescence method, which can be used to measure the thermal diffusivity of gas, liquid and solid, and further obtain the thermal conductivity of the material, belonging to the field of material thermal property analysis. Background technique

[0002] Thermal diffusivity is a very important thermophysical parameter of matter, and thermal diffusivity characterizes the temperature homogenization speed of a material with uneven temperature. Each substance has an intrinsic thermal diffusivity value, and by measuring the thermal diffusivity of the substance, the thermal conductivity properties of the substance can be calculated.

[0003] The meaning of thermal conductivity of a substance is the ratio of the heat flow and temperature gradient of a substance per unit area per unit time, which represents a kind of ability of a substance to transfer heat. The one-dimensional Fo...

Claims

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