Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Control system used for ball grid array (BGA) repair platform

A control system and rework station technology, applied in electrical program control, program control in sequence/logic controller, printed circuit manufacturing, etc., can solve the problem of inaccurate matching of BGA chip pins and PCB pads, and operation Not simple and intuitive enough, temperature control is not accurate enough, etc., to achieve the effect of not simple and intuitive operation, simple structure, convenient and intuitive operation

Inactive Publication Date: 2013-06-05
SHAANXI ZIZHU ELECTRON
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current BGA rework station has shortcomings such as inaccurate temperature control, inaccurate matching of BGA chip pins and PCB pad images, inconvenient and intuitive operation, and low intelligence.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Control system used for ball grid array (BGA) repair platform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Such as figure 1 As shown, the present invention includes a controller 1, a motor driven by a driver 2, a controlled device 4 driven by the motor, a parameter setting and display unit 5, an image detection device 4-4, and a first temperature zone heater 6-1, the temperature monitoring system 6 composed of the second temperature zone heater 6-2, the third temperature zone heater 6-3 and the temperature detection unit 6-4. The number of the motors is 4 and the 4 motors are respectively motor X3-1, motor Y3-2, motor Z3-3 and motor W3-4, and the controlled device 4 includes motor X3-1 and motor W3-4 respectively. The workbench 4-1 that is connected to the motor Y3-2, the optical alignment system 4-2 that is connected to the motor W3-4, and the suction head 4-3 that is connected to the motor Z3-3, The number of the image detection devices 4-4 is two, and the two image detection devices 4-4 are respectively installed on the workbench 4-1 and the suction head 4-3. The driver...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a control system used for a ball grid array (BGA) repair platform. The control system used for the BGA repair platform comprises a controller, motors, a controlled device which is connected with the motors, a parameter setting and displaying unit and a temperature monitoring system, wherein the temperature monitoring system comprises a first warm area heater, a second warm area heater, a third warm area heater and a temperature detecting unit, the motors comprises a motor X, a motor Y, a motor Z and a motor W, the controlled device comprises a working platform which is connected with the motor X and the motor Y in a transmission mode, an optical alignment system which is connected with the motor W in a transmission mode, a sucker connected with the motor Z in a transmission mode and an image detecting device, and an actuator is connected with the controller and the motors. The control system used for the BGA repair platform is simple in structure and convenient to use and operate, can effectively resolve the defects that a traditional BGA repair platform is inaccurate in temperature control, imprecision in the matching of BGA chip pins and printed circuit board (PCB) welding disc images and low in intelligent degree, improves repair rate and production rate, and greatly reduces company production cost.

Description

technical field [0001] The invention relates to a control system, in particular to a control system for a BGA rework station. Background technique [0002] At present, in the electronic industry and other technical fields, the core technology of electronic products - the assembly technology of printed circuit boards is undergoing tremendous changes, supporting the transformation of electronic product component packaging to high-density packaging. BGA chips have the characteristics of multiple pins, large information processing capacity, and small chip size, and have been widely used in the field of digital communications (such as mobile phones, IPTV, handheld secure communication equipment, etc.). At present, the soldering technology of BGA chips has become an indispensable key technology in the assembly of printed circuit boards. The BGA rework station is the operating equipment for visual alignment, welding and disassembly of BGA components of different sizes. The curren...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/30G05B19/05
Inventor 任小勇
Owner SHAANXI ZIZHU ELECTRON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com