Conductive and/or thermally conductive composite material with three-dimensional structure and production method thereof

Abstract

The invention relates to an electrically-conductive and / or thermally-conductive composite material with a three-dimensional structure. The electrically-conductive and / or thermally-conductive composite material comprises at least one composite unit layer, wherein each composite unit layer includes upper and lower surface layers arranged horizontally, and an intermediate layer arranged between the two surface layers; each surface layer is a film, a board or a sheet made of an electrically-conductive and / or thermally-conductive material; the intermediate layer includes a conductor and a packing material which are arranged alternately; and the conductor is made of a material with properties identical to that of the surface layers. The electrically-conductive and / or thermally-conductive composite material with the three-dimensional structure provided by the invention has the advantages of novel conception and easiness in manufacturing, and can save materials by 50% in comparison with the existing thermally-conductive or thermally-conductive material; the cost is lowered greatly by using a plastic material as the base material; and the final product has a firm structure, long service life, and large conduction area, and can realize three-dimensional conduction.

Description

technical field [0001] The invention relates to the technical field of conductive or thermally conductive materials, in particular to a conductive and / or thermally conductive composite material with a three-dimensional structure. Background technique [0002] In the field of electronic technology, due to the increasing integration of electronic circuits, the accumulation of heat is increasing. The accumulation of heat causes the temperature of electronic components to rise and the working stability to decrease. Therefore, the material used for the processor is required to have high thermal conductivity, so that the heat can be conducted out quickly to achieve the purpose of cooling. For highly integrated chips, the design heat energy is so high that it is difficult for ordinary heat sinks to ensure effective heat dissipation. For electronic components that require heat conduction, most of them are borne by high heat conduction ceramics, such as aluminum nitride and boron ni...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: to overcome the technical problem of high cost of conductive and / or thermally conductive materials in the prior art, to provide a conductive and / or thermally conductive composite material with a three-dimensional structure, which can effectively reduce material costs

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