Manufacturing method of led package
A technology of LED packaging and manufacturing method, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of shortened life of LED packaging, poor thermal conductivity of insulating layer, yellowing radiation efficiency, etc., to improve light irradiation efficiency and improve heat dissipation. Efficiency, the effect of simplifying the manufacturing process
Active Publication Date: 2016-09-07
AP TECH CO LTD
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Problems solved by technology
[0006] However, the thermal conductivity of the insulating layer formed on the metal substrate is poor, so even if the metal substrate is used, the problem of low thermal conductivity cannot be avoided.
[0007] Therefore, if the heat dissipation of the LED chip cannot be realized normally, the LED chip as a semiconductor component will have a yellowing phenomenon due to a change in the heat dissipation wavelength, or the light emission efficiency will be reduced, and when operating at a high temperature, the LED package The life of the LED chip may be shortened, so improving the heat dissipation structure of the LED chip is the core of the packaging structure and process
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[0027] The above-mentioned object, technical configuration, functional effect, etc. of the manufacturing method of the LED package according to the present invention will be more clearly understood by referring to the following detailed description with reference to the accompanying drawings showing preferred embodiments of the present invention.
[0028] figure 1 is a cross-sectional view showing an LED package according to the present invention, figure 2 is a plan view showing the LED package according to the present invention.
[0029] As shown in the figure, the LED package 100 according to the present invention may include: a metal substrate 110, which has an anode terminal 111 and a cathode terminal 112; an LED chip 120, which is mounted on the metal substrate 110; a plastic package 130, which is packaged on the metal substrate 110 ; and the lens part 140 , which is integrally formed with the plastic sealing part 130 .
[0030] The metal substrate 110 may be composed ...
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The invention relates to a method for manufacturing an LED package. The manufacturing method of the LED package of the present invention includes the following steps: preparing metal parts cut into strips; forming metal substrates at a certain interval on the above metal parts, and forming an anode terminal and a cathode terminal on the above metal substrate; The LED chip is installed on the chip mounting part; the above LED chip is wire-bonded with the anode terminal and the cathode terminal; and the plastic sealing part and the lens part are integrally formed on the upper part of the above metal substrate.
Description
technical field [0001] The invention relates to a method for manufacturing an LED package, more particularly to a method for manufacturing an LED package that directly mounts an LED chip on a metal substrate to improve heat dissipation efficiency. Background technique [0002] Generally, a light emitting diode (LED: light emitting diode, hereinafter referred to as LED) is used as a diode that flows current in a semiconductor pn junction to emit light. Gallium arsenide (GaAs) is a light emitting diode used for infrared rays, gallium arsenide aluminum (GaAIAs) ) is used as an infrared or red light-emitting diode, gallium arsenide phosphide (GaAsP) is used as a red, orange or yellow light-emitting diode, gallium phosphide (GaP) is used as a red, green or yellow light-emitting diode, nitrogen Gallium nitride (GaN) is a white light-emitting diode that emits white light by mixing rare-earth materials chromium, thulium, and terbium with phosphors used as active ions. [0003] In a...
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IPC IPC(8): H01L33/48H01L33/62
CPCH01L24/97H01L25/0753H01L33/54H01L33/62H01L2224/48091H01L2924/12041H01L2924/181H01L2924/1815H01L2933/005H01L2924/00014H01L2924/00H01L33/48H01L33/58
Inventor 朱宰哲金荣锡
Owner AP TECH CO LTD