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Improved silver paste, application thereof and sintering method of chip and main body of power module

A modification and paste technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of poor bonding between Ag paste and the substrate, and achieve the effects of saving dosage, high working temperature and improving working life

Active Publication Date: 2013-06-26
BYD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a new modified Ag paste and its application and chip and substrate connection in the power module in order to overcome the problem of poor bonding between the Ag paste and the Ni and Cu layers of the substrate in the existing low-temperature sintering Ag technology sintering method

Method used

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  • Improved silver paste, application thereof and sintering method of chip and main body of power module
  • Improved silver paste, application thereof and sintering method of chip and main body of power module
  • Improved silver paste, application thereof and sintering method of chip and main body of power module

Examples

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Embodiment 1

[0048] This embodiment is used to illustrate the sintering method for connecting a chip and a substrate in a power module using the modified Ag paste provided by the present invention.

[0049] Mix Ag metal powder, Sn metal powder and Sb metal powder with a particle size of 40-80nm and organic matter (α-terpineol, acetone, fish oil and polyvinyl butyral) uniformly to prepare a modified Ag paste. Based on the total amount of the modified Ag paste, the metal powder content was 78.5% by weight, and the organic matter content was 21.5% by weight. Based on the total amount of metal powder, the content of Ag metal powder is 84% ​​by weight, the content of Sn metal powder is 10% by weight, and the content of Sb metal powder is 6% by weight; The content of oleyl alcohol was 23% by weight, the content of acetone was 70% by weight, the content of fish oil was 2.3% by weight, and the content of polyvinyl butyral was 4.7% by weight.

[0050] A layer of Ni is plated on the DBC substrate, ...

Embodiment 2

[0052] This embodiment is used to illustrate the sintering method for connecting a chip and a substrate in a power module using the modified Ag paste provided by the present invention.

[0053] Mix Ag metal powder, Sn metal powder and Cu metal powder with a particle size of 8-10 μm with organic matter (α-terpineol, methanol, fish oil and polyvinyl butyral) to make a modified Ag paste. Based on the total amount of modified Ag paste, the content of metal powder was 77% by weight, and the content of organic matter was 23% by weight. Based on the total amount of metal powder, the content of Ag metal powder is 94% by weight, the content of Sn metal powder is 5% by weight, and the content of Cu metal powder is 1% by weight; The content of oleyl alcohol was 17.4% by weight, the content of methanol was 78.2% by weight, the content of fish oil was 2.2% by weight, and the content of polyvinyl butyral was 2.2% by weight.

[0054] A layer of Ni is plated on the AMB substrate, and the mod...

Embodiment 3

[0056] This embodiment is used to illustrate the sintering method for connecting a chip and a substrate in a power module using the modified Ag paste provided by the present invention.

[0057] Mix Ag metal powder, Sn metal powder, Sb metal powder, Cu metal powder, Ni metal powder and Zn metal powder with a particle size of 25-30 μm with organic matter (α-terpineol, methanol, fish oil and polyvinyl butyral ) to mix evenly to make a modified Ag paste. Based on the total amount of modified Ag paste, the content of metal powder is 70% by weight, and the content of organic matter is 30% by weight. Based on the total amount of metal powder, the content of Ag metal powder is 77.98% by weight, the content of Sn metal powder is 12% by weight, the content of Sb metal powder is 8% by weight, the content of Cu metal powder is 2% by weight, Ni The content of metal powder is 0.01% by weight, and the content of Zn metal powder is 0.01% by weight; based on the total amount of organic matter...

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Abstract

The invention discloses an improved silver paste which is characterized by including metal powder and organic matter. Based on the total amount of the improved silver paste, the improved silver paste comprises 70-80wt% of the metal powder and 20-30wt% of the organic matter. The metal powder includes silver and at least one type of stannum, antimony, copper, nickel and zinc. Based on the total amount of the metal powder, the metal powder comprises 75-99.9wt% of the silver, 0-12wt% of the stannum, 0-8wt% of the antimony, 0-5wt% of the copper, 0-0.01wt% of the nickel and 0-0.01wt% of the zinc. The total amount of the stannum, the antimony, the copper, the nickel and the zinc is 0.1-25wt% of the metal powder. The organic matter comprises binder. Based on the total amount of the organic matter, the organic matter comprises 15-100wt% of the binder. The invention further discloses application of the improved silver paste and a sintering method. The improved silver paste can improve binding force of the silver paste and a base body in the process of low-temperature sintering.

Description

technical field [0001] The invention relates to a high-reliability low-temperature sintering technology of a power module, in particular to a modified Ag paste and its application, and a sintering method for connecting a chip and a substrate in a power module using the modified Ag paste. Background technique [0002] Traditionally, Sn-based and Pb-based solders are used in semiconductor power module packaging to achieve electrical connections, but Pb-based solders cannot meet the requirements of environmental protection, and Sn solders can withstand limited operating temperatures due to their low melting points. With the development of hybrid electric vehicles and pure electric vehicles, in order to meet the higher long-term reliability requirements of high-power modules, it is necessary to find a better material than the traditional Sn-based solder to realize the mechanical, Thermal and electrical connections, the substrates in the prior art are generally direct bonded Cu o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F7/04C22C5/06C22C5/08H01L21/58
Inventor 杨钦耀陈刚曾秋莲张昌勇吴超平周莉莉符色艳
Owner BYD SEMICON CO LTD
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