A method for low-temperature bonding of a microfluidic chip
A microfluidic chip, low temperature bonding technology, applied in microstructure technology, microstructure devices, processing microstructure devices, etc., to achieve the effects of reducing production costs, high yield, and reducing requirements
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Embodiment 1
[0022] (1) In the non-channel area on the edge of the glass substrate used to prepare the microfluidic chip with the channel and the inlet and outlet holes of the reaction solution connected to the channel (the designed structure of the experimental area) Make a hole that is not connected with the channel with a diameter of 2 mm, and at this time, the glass substrate has a hole that is connected with the channel and a hole that is not connected with the channel; use deionized water Clean the glass substrate and the glass cover slip used to prepare the microfluidic chip, and dry the glass cover slip and the glass substrate with a hair dryer;
[0023] (2) The sodium silicate solution that the mass percent concentration is 3% is dripped into the non-channel region between the cover glass and the glass substrate obtained after drying in step (1), extruded to the cover glass and the glass The substrates are tightly bonded;
[0024] (3) Put the tightly bonded cover glass and glass ...
Embodiment 2
[0032] (1) In the non-channel area on the edge of the glass substrate used to prepare the microfluidic chip with the channel and the inlet and outlet holes of the reaction solution connected to the channel (the designed structure of the experimental area) Make a hole that is not connected with the channel with a diameter of 4mm, and at this time, the glass substrate has a hole that is connected with the channel and a hole that is not connected with the channel; use deionized water Clean the glass substrate and the glass cover slip used to prepare the microfluidic chip, and dry the glass cover slip and the glass substrate with a hair dryer;
[0033] (2) The sodium silicate solution that the mass percent concentration is 1% is dripped into the non-channel region between the cover glass obtained after drying in step (1) and the glass substrate, and extruded to the cover glass and the glass The substrates are tightly bonded;
[0034] (3) Put the tightly bonded cover glass and gla...
Embodiment 3
[0042] (1) In the non-channel area on the edge of the quartz substrate used to prepare the microfluidic chip with the channel and the inlet and outlet holes of the reaction solution connected to the channel (the designed structure of the experimental area) Make a hole that is not connected to the channel with a diameter of 3mm, and at this time, the quartz substrate has a hole that is connected to the channel and a hole that is not connected to the channel; use deionized water Clean the quartz substrate and the quartz cover for preparing the microfluidic chip, and dry the quartz cover and the quartz substrate with a hair dryer;
[0043] (2) the sodium silicate solution that the mass percent concentration is 2% is dripped into the non-channel region between the quartz cover sheet and the quartz substrate obtained after drying in step (1), extruded to the quartz cover sheet and the quartz substrate. The substrates are tightly bonded;
[0044] (3) Put the tightly bonded quartz c...
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Abstract
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